Co-layered integration and interconnect of planar circuits and nonradiative dielectric (NRD) waveguide

Tang, Jinbang; Wu, Ke

doi:10.1109/22.842022

Cited by 16 publications

(3 citation statements)

References 6 publications

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“…For mm-wave modules, there has been considerable interest in low-loss alternatives to MS and CPW lines, including non-radiative dielectric waveguide [14], MEMS-based hollow rectangular waveguides and SIW [16][17][18]. Owing to the ease of integration with other components, including MMICs, and simple fabrication process, the SIW emerges as a very promising alternative.…”

Section: Siw Up To 180 Ghz In Advanced Multilayer Thickfilm Technologymentioning

confidence: 99%

“…However, at the higher end of the mm-wave band, loss in conventional planar transmission lines (like MS, TFMS, and CPW) increases rapidly due to narrow track width, current crowding at conductor edge, and the irregularities along conductor track. Therefore, for mm-wave circuit and system integration, there has been considerable interest in different waveguide structures [14][15][16][17][18], out of which substrate integrated waveguide (SIW) emerges as highly suitable due to the easy integration with other components including MMICs and its simple fabrication process [16][17][18]. Conventionally, MCM fabrications, including widely preferred ceramic/low-temperature co-fired ceramic (LTCC), have used thick-film technology.…”

Section: Introductionmentioning

confidence: 99%

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Advanced multilayer thick‐film technology and TFMS, CPW, and SIW up to 180 GHz for cost‐effective ceramic‐based circuits and modules

Samanta¹

2018

IET Microwaves, Antennas & Propagation

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This study presents the design, accurate characterisation, and performance comparison for multilayer thin‐film microstrip (TFMS), coplanar waveguide (CPW), and substrate integrated waveguides (SIW) lines and interconnects for various transverse dimensions, which are fabricated on thin dielectric layers, using advanced ceramic‐based photoimageable thick‐film technology. The influence of ground‐plane width on multilayer finite‐ground planar transmission lines (TFMS and CPW) and the influence of cavity dimensions on SIW have been experimentally studied. This includes the variation of characteristic impedance and attenuation with normalised ground‐/cavity‐width and extending frequency to beyond 110 GHz (180 GHz, for SIW). Contrary to conventional fence‐post, metal‐filled trenches have been used for SIW, showing high performance (loss of 0.2 dB/mm at 110 GHz, even for a thin dielectric) and suitable for operation beyond 180 GHz, the highest frequency reported for off‐chip integration in MCMs. Further, for the first time, comprehensive comparative performances of traditional microstrip, TFMS, CPW, and SIW, in circuit/system design perspective, have been presented for enabling proper selection of transmission media and interconnect with optimum transverse/ground width, and development of compact and high performance millimetre‐wave multichip module front‐ends economically.

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Section: Siw Up To 180 Ghz In Advanced Multilayer Thickfilm Technologymentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Advanced multilayer thick‐film technology and TFMS, CPW, and SIW up to 180 GHz for cost‐effective ceramic‐based circuits and modules

Samanta¹

2018

IET Microwaves, Antennas & Propagation

View full text Add to dashboard Cite

show abstract

“…There has been renewed interest in dielectric and non-radiative dielectric waveguides recently [1,2,3]. These structures provide very low-loss transmission and are likely to be the preferred transmission line medium for future 3D MMICs at upper mm-wave frequencies.…”

Section: Introductionmentioning

confidence: 99%