Co-packaged Optics for Data Center Switching

Stone, R.M.; Chen, Ruby; Rahn, Jeff; Venkataraman, Srinivas; Wang, Xu; Schmidtke, Katharine; Stewart, Jason A.

doi:10.1109/ecoc48923.2020.9333175

Cited by 12 publications

(9 citation statements)

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“…As data rate increases, traditional pluggable optical modules occupy a large volume, limiting the signal density to a certain extent (Fig. 8(a)) [13]. Figure 8(b) shows an architecture of copackaged optics (CPO), where the optical engine and switching chip can be packaged together, the host-side of the re-timing chip is connected to the payload ASIC by XSR SerDes, and the line-side of the re-timing chip is connected to the optical engine by LR SerDes [13].…”

Section: Statusmentioning

confidence: 99%

“…8(a)) [13]. Figure 8(b) shows an architecture of copackaged optics (CPO), where the optical engine and switching chip can be packaged together, the host-side of the re-timing chip is connected to the payload ASIC by XSR SerDes, and the line-side of the re-timing chip is connected to the optical engine by LR SerDes [13]. Thus, CPO effectively reduces power consumption, increases signal density, and reduces latency.…”

Section: Statusmentioning

confidence: 99%

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Co-packaged optics (CPO): status, challenges, and solutions

Tan

Liu³

et al. 2023

Front. Optoelectron.

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Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three-fourths of the datacenter traffic resides within datacenters. The conventional pluggable optics increases at a much slower rate than that of datacenter traffic. The gap between application requirements and the capability of conventional pluggable optics keeps increasing, a trend that is unsustainable. Co-packaged optics (CPO) is a disruptive approach to increasing the interconnecting bandwidth density and energy efficiency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics. CPO is widely regarded as a promising solution for future datacenter interconnections, and silicon platform is the most promising platform for large-scale integration. Leading international companies (e.g., Intel, Broadcom and IBM) have heavily investigated in CPO technology, an inter-disciplinary research field that involves photonic devices, integrated circuits design, packaging, photonic device modeling, electronic-photonic co-simulation, applications, and standardization. This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform, identify the key challenges, and point out the potential solutions, hoping to encourage collaboration between different research fields to accelerate the development of CPO technology. Graphical Abstract

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Section: Statusmentioning

confidence: 99%

Section: Statusmentioning

confidence: 99%

Co-packaged optics (CPO): status, challenges, and solutions

Tan

Liu³

et al. 2023

Front. Optoelectron.

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“…As shown in Figure 16g, data center switch ASICs of 51 Tbps are expected to be introduced by 2024, and those of 100 Tbps are expected before 2027, which represent substantially higher bandwidths than the bisection bandwidths reported in the demonstration platforms in this paper. There are now massive efforts underway to move optical transceiver cores or "chiplets" into the switch ASIC package itself, in so-called copackaged optical (CPO) assemblies as shown in Figure 16a [29].…”

Section: Copackaged Optical Assembly-the Ultimate Migration Of System-level Optical Interconnectmentioning

confidence: 99%

Evolution of System Embedded Optical Interconnect in Sub-Top-of-Rack Data Center Systems

et al. 2022

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In this paper we review key technological milestones in system embedded optical interconnects in data centers that have been achieved between 2014 and 2020 on major European Union research and development projects. This includes the development of proprietary optically enabled data storage and switch systems and optically enabled data storage and compute subsystems. We report on four optically enabled data center system demonstrators: LightningValley, ThunderValley2, Pegasus and Aurora, which include advanced optical circuits based on polymer waveguides and fibers and proprietary electro-optical connectors. We also report on optically enabled subsystems including Ethernet-connected hard disk drives and microservers. Both are designed in the same pluggable carrier form factor and with embedded optical transceiver and connector interfaces, thus allowing, for the first time, both compute and storage nodes to be optically interchangeable and directly interconnectable over long distances. Finally, we present the Nexus platform, which allows different optically enabled data center test systems and subsystems to be interconnected and comparatively characterized within a data center test environment.

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“…This architecture can be easily scaled to higher capacities by adding further optical modules or to connect a higher number of antenna elements, thus accommodating various product variants with different bandwidths and antenna array sizes. Radio equipment generally requires a lower aggregate capacity than DCIs [13] but also the capability to scale up capacity and power consumption more effectively. Moreover, even if the transceiver volumes in radio are comparable or even higher than in DCI applications, the target cost is lower.…”

Section: Introductionmentioning

confidence: 99%

Silicon Photonic Micro-Transceivers for Beyond 5G Environments

Kurata¹,

Giorgi

Cavaliere

et al. 2021

Applied Sciences

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Here, we report on the design and performance of a silicon photonic micro-transceiver required to operate in 5G and 6G environments at high ambient temperatures above 105 °C. The four-channel “IOCore” micro-transceiver incorporates a 1310 nm quantum dot laser system and operates at a data rate of 25 Gbps and higher. The 5 × 5 mm micro-transceiver chip benefits from a multimode coupling interface for low-cost assembly and robust connectivity at high temperatures as well as an optical redundancy scheme, which increases reliability by over an order of magnitude.

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Co-packaged Optics for Data Center Switching

Cited by 12 publications

References 0 publications

Co-packaged optics (CPO): status, challenges, and solutions

Co-packaged optics (CPO): status, challenges, and solutions

Evolution of System Embedded Optical Interconnect in Sub-Top-of-Rack Data Center Systems

Silicon Photonic Micro-Transceivers for Beyond 5G Environments

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