CO2 Lasers

Jitsuno, Takahisa; Uno, Kazuyuki

doi:10.1007/978-3-319-69537-2_56-1

Cited by 1 publication

(1 citation statement)

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“…While CW lasers emit steady beams with consistent energy characteristics over time, pulsed lasers allow for a train of individual pulses to be emitted with different pulse widths and frequencies. For example, CO 2 lasers are very limited regarding pulse width (PW) in the millisecond to microsecond range, [ 73 ] while other laser configurations allow for very short laser pulses in the pico to femtosecond range, using different pulsing strategies such as q‐switching and mode‐locking [ 74 ] (Figure 4b). For writing and patterning tasks, the optics systems that shape the laser beam must be coupled with control systems, capable of directing it at determined locations.…”

Section: Dlw Principles For Electronics Microfabricationmentioning

confidence: 99%

Direct Laser Writing: From Materials Synthesis and Conversion to Electronic Device Processing

Pinheiro,

Morais,

Silvestre

et al. 2024

Advanced Materials

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Direct Laser Writing (DLW) has been increasingly selected as a microfabrication route for efficient, cost‐effective, high‐resolution material synthesis and conversion. Concurrently, lasers participate in the patterning and assembly of functional geometries in several fields of application, of which electronics stand out. In this review, we survey and outline recent advances and strategies based on DLW for electronics microfabrication, based on laser material growth strategies. First, we summarize the main DLW parameters influencing material synthesis and transformation mechanisms, aimed at selective, tailored writing of conductive and semiconducting materials. Additive and transformative DLW processing mechanisms are discussed, to open space to explore several categories of materials directly synthesized or transformed for electronics microfabrication. These include metallic conductors, metal oxides, transition metal chalcogenides and carbides, laser‐induced graphene, and their mixtures. By accessing a wide range of material types, DLW‐based electronic applications are explored, including processing components, energy harvesting and storage, sensing, and bioelectronics. The expanded capability of lasers to participate in multiple fabrication steps at different implementation levels, from material engineering to device processing, indicates their future applicability to next‐generation electronics, where more accessible, green microfabrication approaches integrate lasers as comprehensive tools.This article is protected by copyright. All rights reserved

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Section: Dlw Principles For Electronics Microfabricationmentioning

confidence: 99%