Coating dense silicon carbide layer on artificial graphites to achieve synergistically enhanced thermal conductivity and electronic insulation of polymer composites

Huang, Min; Tian, Yexin; Kong, Nizao; Liao, Gen; Fu, Liqin; Wen, Bingjie; Jia, Kun; Wang, Shuang; Liu, Jinshui; Han, Fei

doi:10.1002/app.53983

Cited by 4 publications

(1 citation statement)

References 38 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…However, its thermal conductivity remains relatively low, posing a challenge for meeting the increasing need for heat dissipation 11 . Incorporating inorganic filler particles into materials can significantly improve their thermal conductivity, notable examples being graphene, 12,13 graphite, 14 boron nitride, 15–17 silicon carbide (SiC), 18 and so on. By incorporating thermal conductive fillers, the material's thermal conductivity can be enhanced, thereby yielding more optimal new composites for electronic packaging 19,20 …”

Section: Introductionmentioning

confidence: 99%

Three‐dimensional skeleton assembled by nickel foam/silicon carbide as filler in polyurethane composites with high thermal conductivity and electrical insulation

Zhu,

Ren,

Chen

et al. 2024

Polymer Engineering & Sci

View full text Add to dashboard Cite

High thermally conductive polymer composites have garnered significant attention due to their exceptional performance, given the ever‐decreasing size of electronic devices and the rise in power densities. Herein, a new three‐dimensional (3D) thermal conductivity network structure has been successfully prepared using double fillers of nickel foam (NF) and modified silicon carbide particles (KSiC). The study compared the effect of different filler contents on the thermal conductivity of composites. Compared to conventional composites, those based on 3D filling networks have significantly improved thermal conductivity. The thermal conductivity of the NF/KSiC/PU composite containing 50 wt% KSiC was 1.18 Wm−1 K−1, exceeding the cumulative thermal conductivity of the NF/PU and KSiC/PU 50 wt% composites, and 637.5% greater than that of neat PU. Meanwhile, the synthesized NF/KSiC/PU composite maintained a high electrical resistivity above 1012 Ω·cm and good mechanical properties. This approach might offer novel solutions for developing high‐quality packaging materials for advanced electronic devices with exceptional thermal and mechanical properties.Highlights Using SiC and NF Constructs a dual filler network. The dual filler thermal conductivity network can generate synergistic effects. Improving thermal conductivity compared to original polyurethane. Maintaining a high electrical resistivity and good mechanical properties.

show abstract

Section: Introductionmentioning

confidence: 99%

Three‐dimensional skeleton assembled by nickel foam/silicon carbide as filler in polyurethane composites with high thermal conductivity and electrical insulation

Zhu,

Ren,

Chen

et al. 2024

Polymer Engineering & Sci

View full text Add to dashboard Cite

show abstract

Integration of Heterogeneous Interfaces and Multi‐Dimensional Encapsulation Structure in Fe₂N@CNTs Enabling Highly Efficient Thermal Management and Microwave Absorption

Wang,

Miao,

Gao

et al. 2024

Adv Funct Materials

View full text Add to dashboard Cite

The opposing effects of interface effect on phonon heat conduction and microwave absorption hinder the integration of thermal conduction with microwave absorption. Reconciling this contradiction by rationally optimizing the material structure remains a challenge. Herein, Fe2N@CNTs with heterogeneous interfaces and multi‐dimensional encapsulated structures are fabricated through in situ chemical vapor deposition (CVD) to realize excellent thermal conductivity and microwave absorption. When the mass fraction of active material is 40 wt.%, the thermal conductivity (λ//) of Fe2N@CNTs composite films is 6.69 W m−1 K−1. The minimum reflection loss (RLmin) is up to −54.55 dB at a thickness of 3.43 mm, and the effective absorption bandwidth (EAB) is 5.52 GHz at 1.82 mm. The well‐designed Fe2N@CNTs is an ideal model for gaining insight into electron transportation and phonon multi‐dimensional heat transport. Heterogeneous interface improves the dielectric loss and facilitates microwave and phonon absorption and conversion. The multi‐dimensional encapsulation structure increases the electron transport path and phonon heat transport paths making axial and radial co‐transfer possible. The multi‐dimensional encapsulation structure demonstrates extremely high microwave absorption and thermal management capabilities, which open up new possibilities for multifunctional applications in host materials with internal hollows.

show abstract

Designing insulative SiC coating layer on the artificial graphite particle to achieve synergy of wave absorption and thermal conduction

Tian

Huang

Kong

et al. 2023

Carbon

View full text Add to dashboard Cite

Coating dense silicon carbide layer on artificial graphites to achieve synergistically enhanced thermal conductivity and electronic insulation of polymer composites

Cited by 4 publications

References 38 publications

Three‐dimensional skeleton assembled by nickel foam/silicon carbide as filler in polyurethane composites with high thermal conductivity and electrical insulation

Three‐dimensional skeleton assembled by nickel foam/silicon carbide as filler in polyurethane composites with high thermal conductivity and electrical insulation

Integration of Heterogeneous Interfaces and Multi‐Dimensional Encapsulation Structure in Fe₂N@CNTs Enabling Highly Efficient Thermal Management and Microwave Absorption

Designing insulative SiC coating layer on the artificial graphite particle to achieve synergy of wave absorption and thermal conduction

Contact Info

Product

Resources

About

Coating dense silicon carbide layer on artificial graphites to achieve synergistically enhanced thermal conductivity and electronic insulation of polymer composites

Cited by 4 publications

References 38 publications

Three‐dimensional skeleton assembled by nickel foam/silicon carbide as filler in polyurethane composites with high thermal conductivity and electrical insulation

Three‐dimensional skeleton assembled by nickel foam/silicon carbide as filler in polyurethane composites with high thermal conductivity and electrical insulation

Integration of Heterogeneous Interfaces and Multi‐Dimensional Encapsulation Structure in Fe2N@CNTs Enabling Highly Efficient Thermal Management and Microwave Absorption

Designing insulative SiC coating layer on the artificial graphite particle to achieve synergy of wave absorption and thermal conduction

Contact Info

Product

Resources

About

Integration of Heterogeneous Interfaces and Multi‐Dimensional Encapsulation Structure in Fe₂N@CNTs Enabling Highly Efficient Thermal Management and Microwave Absorption