“…The characterizations of SAMs on copper, such as surface morphology, defects in the film, adhesion, wettability, and molecular identification [1][2][3][4], are very important. Many complementary methods have been utilized for the characterization of SAMs on copper, including (but are not limited to) reflectance infrared spectroscopy (IR) [3,5], X-ray photoelectron spectroscopy (XPS) [6,7], scanning electronic microscopy (SEM) [8,9], ellipsometry, contact angles (CA) [3,9], as well as electrochemical analysis, including cyclic voltammetry (CV) and electrochemical impedance spectroscopy (EIS) [10][11][12][13]. IR and XPS identified specific functional groups and oxidation states.…”