2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/ 2015
DOI: 10.1109/iitc-mam.2015.7325635
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Cobalt compatible cleaning solutions for 14nm and beyond

Abstract: In this paper, wet cleaning solution compatible with cobalt are investigated to achieve low Co etching rate on blankets film and no film attack on patterned 14nm wafer after line and via etching. Proposed solutions are compared to conventional wet cleaning solutions [5], [6].

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