2019
DOI: 10.1007/s10854-019-01366-1
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Cobalt germanide contacts: growth reaction, phase formation models, and electrical properties

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Cited by 2 publications
(5 citation statements)
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“…Germanides are a class of materials that have garnered significant attention because of their potential thermoelectric and electronic applications. 23,24 These compounds are formed by combining germanium with diverse metallic elements such as iron, nickel, cobalt, and palladium. [25][26][27][28] Germanides are characterized by high electrical conductivity, low thermal conductivity, and favorable thermoelectric characteristics that make them attractive.…”
Section: Introductionmentioning
confidence: 99%
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“…Germanides are a class of materials that have garnered significant attention because of their potential thermoelectric and electronic applications. 23,24 These compounds are formed by combining germanium with diverse metallic elements such as iron, nickel, cobalt, and palladium. [25][26][27][28] Germanides are characterized by high electrical conductivity, low thermal conductivity, and favorable thermoelectric characteristics that make them attractive.…”
Section: Introductionmentioning
confidence: 99%
“…[25][26][27][28] Germanides are characterized by high electrical conductivity, low thermal conductivity, and favorable thermoelectric characteristics that make them attractive. 24,29,30 As such, germanides have emerged as promising active materials for thermoelectric generators, coolers, and electronic devices (e.g., transistors, diodes, integrated circuit interconnects). 27,28,[30][31][32] Embracing the principles of high-entropy alloying can provide enhancement of thermoelectric performance and substantial progress has been achieved in the field of high-performance high-entropy alloy thermoelectrics.…”
Section: Introductionmentioning
confidence: 99%
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“…[282][283] The siliconrich CoSi2 is the most relevant binary Co-Si phase as it played an important role in the semiconductor industry where it was used as a contact material in complementary metal-oxide semiconductor (CMOS) devices. 284 Initially, aluminum was used as electrode material, however, the tendency of it to diffuse into the silicon required the implementation of diffusion barriers. Transition metal silicides were the material of choice as they not only fulfill the required physical properties (low resistivity, good thermal stability) but also can be formed in a selfaligned silicide (SALICIDE) process.…”
Section: Co-simentioning
confidence: 99%
“…With the advent of FinFET technology requirements for silicide contacts changed and the industry returned to TiSi. 284…”
Section: Co-simentioning
confidence: 99%