Combination of E-Jet and Inkjet Printing for Additive Fabrication of Multilayer High-Density RDL of Silicon Interposer

Laurila, Mika-Matti; Khorramdel, Behnam; Mäntysalo, Matti

doi:10.1109/ted.2016.2644728

Cited by 27 publications

(22 citation statements)

References 18 publications

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“…The existing TSV technology is improved by Zhang Y. et al [27] with the integrated process, as shown in Figure 1. Laurila M.-M. et al [28] proposed a method to fabricate the RDL (redistribution layers) of the silicon interposers using a combination of E-Jet and Inkjet Printing, which was environmentally careful and can reduce material waste and costs compared with photolithography. The above methods of metallizing TSVs are summarized in Table 1.…”

Section: Silicon Interposer Productionmentioning

confidence: 99%

“…On-silicon-interposer N/A N/A Four times higher than the data rate of HBM generation 2 [26] 3D integration 100/40 µm Lower Simplified the integrated process flows, enhanced the reliability [27] high-density RDLs of silicon interposers -/10 µm Lower reduce the amount of waste materials [28] Electronics 2018, 7, x FOR PEER REVIEW 3 of 29 [24]…”

Section: Application Via Depth/diametermentioning

confidence: 99%

“…On-siliconinterposer N/A N/A Four times higher than the data rate of HBM generation 2 [26] 3D integration 100/40 μm Lower Simplified the integrated process flows, enhanced the reliability [27] high-density RDLs of silicon interposers -/10 μm Lower reduce the amount of waste materials [28] (a) (b) (c) (d) Figure 1. Silicon interposer through electrical copper coating technology production: (a) The construction of through-silicon via on the wafer; (b) The dry film etchant is stuck on the wafer, then exposed and etched; (c) Hole plating and pad fabrication by electroplating methods; (d) The photoresist removing.…”

Section: Application Via Depth/diametermentioning

confidence: 99%

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TSV Technology and High-Energy Heavy Ions Radiation Impact Review

Tian

Liu

2018

Electronics

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Three-dimensional integrated circuits (3D IC) based on TSV (Through Silicon Via) technology is the latest packaging technology with the smallest size and quality. As a result, it can effectively reduce parasitic effects, improve work efficiency, reduce the power consumption of the chip, and so on. TSV-based silicon interposers have been applied in the ground environment. In order to meet the miniaturization, high performance and low-cost requirements of aerospace equipment, the adapter substrate is a better choice. However, the transfer substrate, as an important part of 3D integrated circuits, may accumulate charge due to heavy ion irradiation and further reduce the performance of the entire chip package in harsh space radiation environment or cause it to fail completely. Little research has been carried out until now. This article summarizes the research methods and conclusions of the research on silicon interposers and TSV technology in recent years, as well as the influence of high-energy heavy ions on semiconductor devices. Based on this, a series of research methods to study the effect of high-energy heavy ions on TSV and silicon adapter plates is proposed.Electronics 2018, 7, 112 2 of 29 wafer was invented by M.G Smith et al. [2], which opposite surfaces were connected ohmically to the degenerately doped portions to be electrically connected along the thru-connection. With further research and exploration, 2.5D/3D integration technology with TSV realized integrated circuits with advantages of high interconnection density, high performance, low power consumption, and low cost [3,4]. In addition, the core is widely considered to be the leading technology in the field of high density packaging in the future and is an effective way to break through Moore's Law [5][6][7]. Figure 1. Silicon interposer through electrical copper coating technology production: (a) The construction of through-silicon via on the wafer; (b) The dry film etchant is stuck on the wafer, then exposed and etched; (c) Hole plating and pad fabrication by electroplating methods; (d) The photoresist removing. Adapted with permission from [27], Copyright Elsevier, 2016.

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Section: Silicon Interposer Productionmentioning

confidence: 99%

Section: Application Via Depth/diametermentioning

confidence: 99%

Section: Application Via Depth/diametermentioning

confidence: 99%

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TSV Technology and High-Energy Heavy Ions Radiation Impact Review

Tian

Liu

2018

Electronics

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“…An alternative to classical inkjet printing is based on electrohydrodynamic printing, which has become of considerable interest due to its capability of focusing even smaller volumes of fluid via electrostatic forces for different ejection modes . Electrohydrodynamic inkjet printing of nanoparticle ink in femtoliter droplets has been reported for specialized applications in micro and nanotechnology . For example, electrohydrodynamic inkjet systems can produce elaborate sub‐micrometer, conductive 3D structures such as straight and tilted pillars, helices, walls, and bridges .…”

Section: Introductionmentioning

confidence: 99%

“…[34] Electrohydrodynamic inkjet printing of nanoparticle ink in femtoliter droplets has been reported for specialized applications in micro and nanotechnology. [35,36] For example, electrohydrodynamic inkjet systems can produce elaborate sub-micrometer, conductive 3D structures such as straight and tilted pillars, helices, walls, and bridges. [37,38] If integrated with individually addressable MEAs, these structures might be of interest for cell-chip coupling devices and biosensors.…”

Section: Introductionmentioning

confidence: 99%

Printed 3D Electrode Arrays with Micrometer‐Scale Lateral Resolution for Extracellular Recording of Action Potentials

Grob

Yamamoto

Zips

et al. 2019

Adv Materials Technologies

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Current investigations on neuronal or cardiac tissues call for systems that can electrically monitor cellular activity in three dimensions as opposed to classical planar approaches. Typically the fabrication of such 3D microelectrode arrays (3D MEAs) relies on advanced cleanroom fabrication techniques. However, additive manufacturing is becoming an ever versatile alternative for rapid prototyping of novel sensor designs due to its low cost and material expense. Here, the possibility of fabricating high‐resolution 3D MEAs is demonstrated by using electrohydrodynamic inkjet printing. The height and aspect ratio of the 3D electrodes can be readily tuned by adjusting the printing conditions and number of deposited ink droplets per electrode. The fabrication of pillar electrode arrays with electrode diameters of sintered structures below 3 µm is shown. The functionality of the array is confirmed using impedance spectroscopy and extracellular recordings of action potentials from HL‐1 cells.

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Ultrasoft Silicone Gel as a Biomimetic Passivation Layer in Inkjet‐Printed 3D MEA Devices

et al. 2019

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Multielectrode arrays (MEAs) are versatile tools that are used for chronic recording and stimulation of neural cells and tissues. Driven by the recent progress in understanding of how neuronal growth and function respond to scaffold stiffness, development of MEAs with a soft cell-to-device interface has gained importance not only for in vivo but also for in vitro applications. However, the passivation layer, which constitutes the majority of the cell-device interface, is typically prepared with stiff materials. Herein, a fabrication of a MEA device with an ultrasoft passivation layer is described, which takes advantage of inkjet printing and a polydimethylsiloxane (PDMS) gel with a stiffness comparable to that of the brain. The major challenge in using the PDMS gel is that it cannot be patterned to expose the sensing area of the electrode. This issue is resolved by printing 3D micropillars at the electrode tip. Primary cortical neurons are grown on the fabricated device, and effective stimulation of the culture confirms functional cell-device coupling. The 3D MEA device with an ultrasoft interface provides a novel platform for investigating evoked activity and drug responses of living neuronal networks cultured in a biomimetic environment for both fundamental research and pharmaceutical applications.

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Combination of E-Jet and Inkjet Printing for Additive Fabrication of Multilayer High-Density RDL of Silicon Interposer

Cited by 27 publications

References 18 publications

TSV Technology and High-Energy Heavy Ions Radiation Impact Review

TSV Technology and High-Energy Heavy Ions Radiation Impact Review

Printed 3D Electrode Arrays with Micrometer‐Scale Lateral Resolution for Extracellular Recording of Action Potentials

Ultrasoft Silicone Gel as a Biomimetic Passivation Layer in Inkjet‐Printed 3D MEA Devices

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