A low-pressure chemical vapor deposition (CVD) reactor was modified to produce a continuous compositional spread of titanium, tin, and hafnium dioxides on a single Si(100) wafer. The corresponding anhydrous metal nitrates, Ti(NO 3 ) 4 , Sn(NO 3 ) 4 , and Hf(NO 3 ) 4 , were used as single-source precursors to the component oxides. The compositions were mapped using X-ray photoelectron spectroscopy and Rutherford backscattering spectrometry. On a single wafer an array of 100 µm × 100 µm capacitors was used to map the effective dielectric constant (κ eff ) of the films. For compositional spreads grown at 400 and 450 °C κ eff reached a maximum value in regions with the highest concentrations of TiO 2 . The formation of the orthorhombic R-PbO 2 phase for a composition near Hf 0.75 Sn 0.25 O 2 was also observed in the 450 °C compositional spread.