Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders

Laurila, Tomi; Vuorinen, Vesa

doi:10.3390/ma2041796

Cited by 24 publications

(11 citation statements)

References 65 publications

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“…In the backscattered electron image of Figure in the interfacial zone during ageing. This was not observed in the current investigation after three months at 150°C or 200°C, most likely because the Au capping layer on the ENIG used was much thinner than in [23]. The transformation of NiSn4 or (Au,Ni)Sn4 eutectic did not go to completion at 150C in the 3 month time frame of the present study, indicating that decomposition would depend on the working environment of a solder joint and it is highly likely to be ongoing throughout its life.…”

Section: Ag/enig Joints At 150°ccontrasting

confidence: 60%

Metastable eutectic in Pb-free joints between Sn–3.5Ag and Ni-based substrates

Belyakov

Gourlay

2015

Materials Letters

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Abstract:Microstructure development in solder joints between Sn-3.5Ag and Ni-based substrates has been widely reported. However, in the present study we illustrate a new phenomenon: that during soldering of Sn-3.5Ag to Ni or ENIG (electroless nickel, immersion gold), the bulk solder solidifies to contain a metastable eutectic consisting of βSn+Ag3Sn+NiSn4 instead of the βSn+Ag3Sn+Ni3Sn4, expected of equilibrium solidification. It is shown that metastable NiSn4 coarsens and then decomposes into Ni3Sn4 and βSn during ageing at 150 and 200˚C and that coarsened NiSn4 deteriorate impact shear properties.

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Section: Ag/enig Joints At 150°ccontrasting

confidence: 60%

Metastable eutectic in Pb-free joints between Sn–3.5Ag and Ni-based substrates

Belyakov

Gourlay

2015

Materials Letters

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“…Ni acts as a diffusion barrier layer for Cu/ Sn-based solders in electronics, since the reaction rate of Ni with Sn is typically several orders of magnitude lower than that of Cu with Sn. 12,13 Use of Ni has been associated with improvement in solidification microstructures, increased volume fraction of eutectic phase, and lower propensity for interfacial IMCs to crack during service. 14 Though ENIG is suggested for long-term applications, it is prone to black pad, which forms during the plating process and can lead to early failure.…”

Section: Introductionmentioning

confidence: 99%

Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates

Sona

Prabhu

2016

Journal of Elec Materi

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The effect of reflow time on wetting behavior of Sn-2.5Ag-0.5Cu lead-free solder on bare and nickel-coated copper substrates has been investigated. The solder alloy was reflowed at 270°C for various reflow times of 10 s, 100 s, 300 s, and 500 s. On bare copper substrate, the intermetallic compound (IMC) thickness increased with increase in reflow time, whereas on Ni-coated Cu substrate, the IMC thickness increased up to 300 s followed by a drop for solder alloy reflowed for 500 s. The spreading behavior of the solder alloy was categorized into capillary, gravity (diffusion), and viscous zones. Gravity zone was obtained from 3.8 ± 0.43 s to 38.97 ± 3.38 s and from 5.99 ± 0.5 s to 77.82 ± 8.84 s for the Sn-2.5Ag-0.5Cu/Cu and Sn-2.5Ag-0.5Cu/Ni/Cu system, respectively. Sn-2.5Ag-0.5Cu solder alloy was also reflowed for the period corresponding to the end of the gravity zone (40 s and 80 s on bare and Nicoated Cu, respectively). The joint strength was maximum at reflow time of 40 s and 80 s for the Sn-2.5Ag-0.5Cu/Cu and Sn-2.5Ag-0.5Cu/Ni/Cu system, respectively. The dynamic contact angle at the end of the gravity (diffusion) zone (h gz ) was found to be a better parameter compared with the stabilized contact angle (h f ) to assess the effect of the wettability of the liquid solder on the microstructure and joint strength. The present investigation reveals the significance of the gravity zone in assessment of optimum reflow time for leadfree solder alloys.

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“…Laurila and Vuorinen [15] also found that Ni 3 P IMC formation can be suppressed when the P content reached 30 at%. However, the researchers did not mention the exact reason of what was happening to the surface of the coated copper when different P content was used.…”

Section: Introductionmentioning

confidence: 89%

Development of diffusion barrier layer on copper-printed circuit board using electroless plating method

Idris¹,

Ourdjini²,

Ariff³

et al. 2015

Int. J. CMEM

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In this paper, the nickel-phosphorus (Ni-P) diffusion barrier layer between Sn-4Ag-0.5Cu solder alloy and copper-printed circuit board was developed. The electroless plating technique was used to develop Ni-P diffusion barrier layer with different percentage of phosphorus content, which are 1-5 wt% (low), 5-8 wt% (medium) and above 8 wt% (high). The results reveal that the high phosphorus content in nickel layer acts as a good diffusion barrier for Sn-4Ag-0.5Cu since it can suppress the intermetallic compound formation. This is because in higher phosphorus content, the grain boundaries were found to be eliminated. Hence, resulted in thinner intermetallic compound thickness.

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Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders

Cited by 24 publications

References 65 publications

Metastable eutectic in Pb-free joints between Sn–3.5Ag and Ni-based substrates

Metastable eutectic in Pb-free joints between Sn–3.5Ag and Ni-based substrates

Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates

Development of diffusion barrier layer on copper-printed circuit board using electroless plating method

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