2010
DOI: 10.1243/09544054jem1794
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Combining business process and failure modelling to increase yield in electronics manufacturing

Abstract: The prediction and capturing of defects in low-volume assembly of electronics is a technical challenge that is a prerequisite for design for manufacturing (DfM) and business process improvement (BPI) to increase first-time yields and reduce production costs. Failures at the component-level (component defects) and system-level (such as defects in design and manufacturing) have not been incorporated in combined prediction models. BPI efforts should have predictive capability while supporting flexible production … Show more

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“…The experimental results of this study can provide a reference to the SMT industry for improving the product quality. 1,2,11,12,16,18,21,24–26…”
Section: Discussionmentioning
confidence: 99%
“…The experimental results of this study can provide a reference to the SMT industry for improving the product quality. 1,2,11,12,16,18,21,24–26…”
Section: Discussionmentioning
confidence: 99%