Common-mode currents generated by circuits on a PCB-measurements and transmission-line calculations

Horck, F.B.M. van; Deursen, A.P.J. van; Laan, P.C.T. van der

doi:10.1109/15.974641

Cited by 12 publications

(11 citation statements)

References 20 publications

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“…However, the results of the computations using this formula substantially diverge from those obtained using the other methods (e.g., Schwarz-Christoffel conformal mapping [41]), especially when the thickness of the ground plane increases, and when the width of the ground plane decreases. This suggests that the edge current should be considered as a distributed current, rather than a lumped filamentary current.…”

Section: Symmetrical Microstrip Structurementioning

confidence: 67%

“…However, when the trace is shifted from the central position to the edge, the discrepancy between the corresponding graphs in these figures increases, especially for a wider ground plane. This can be explained by the fact that the papers [16,24,41] do not take into account the width Method of edge currents Van Horck's edge value [16] C onformal mapping [41] Approximation in [24] w g =10 mm Method of edge currents Van Horck's edge value [16] C onformal mapping [41] Approximation [24] w g =100 mm of the trace and the thickness of the ground plane, while the approach presented herein does. The other reason for overestimating the mutual inductance value in the MEC is concentrating an edge current close to the edge, while in reality it will be more spread under the ground plane towards the center.…”

Section: Asymmetrical Microstrip Structurementioning

confidence: 99%

“…It is known that this inductance gives rise to the radiation from cables due to the common-mode voltage associated with a finite size signal reference plane. The results of the computations obtained from the proposed method are compared with the literature results based on the Schwarz-Christoffel (SC) conformal mapping transformation [41], as well as some experimental data, and some results of full-wave numerical modeling fulfilled using the CST Microwave Studio (CST MWS ) software. The external mutual inductance is found from the CST MWS calculations as…”

Section: Introductionmentioning

confidence: 99%

“…For these graphs, the width of the trace was taken as w s = 0.1 mm, and half of the thickness of the ground plane was R = 0.01 mm. As is seen in Figure 5(a), the results of the analytical integration using Maple and the calculations using a formula, following from the Schwarz-Christoffel (SC) conformal mapping [18,41],…”

Section: Symmetrical Microstrip Structurementioning

confidence: 99%

“…In the CST MWS modeling it was noticed that the edge value of M increases with the increase of the computational domain (10% difference for two abovementioned computational domains). This is because more fringing magnetic flux is captured within the computational domain of a bigger volume, especially, when it increases in the y-direction and in the negative z- Method of E dge C urrents C ST Microwave S tudio Van Horck's E dge value [16] C onformal Mapping [41] A pproximation [24] E xperimental data [44] w g =100 mm direction. Also, the calculated external inductance in the CST MWS is slightly higher at d.c. than at higher frequencies (∼ 140 MHz), and this difference is around 2%.…”

Section: Asymmetrical Microstrip Structurementioning

confidence: 99%

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Method of Edge Currents for Calculating Mutual External Inductance in a Microstrip Structure

Koledintseva¹,

Drewniak²,

Doren³

et al. 2008

PIER

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Abstract-Mutual external inductance (MEI) associated with fringing magnetic fields in planar transmission lines is a cause of socalled "ground plane noise", which leads to radiation from printed circuit boards in high-speed electronic equipment. Herein, a Method of Edge Currents (MEC) is proposed for calculating the MEI associated with fringing magnetic fields that wrap the ground plane of a microstrip line. This method employs a quasi-magnetostatic approach and direct magnetic field integration, so the resultant MEI is frequencyindependent. It is shown that when infinitely wide ground planes are cut to form ground planes of finite width, the residual surface currents on the tails that are cut off may be redistributed on the edges of the ground planes of finite thickness, forming edge currents. These edge currents shrink to filament currents when the thickness of the ground plane becomes negligible. It is shown that the mutual external inductance is determined by the magnetic flux produced by these edge currents, while the contributions to the magnetic flux by the currents from the signal trace and the finite-size ground plane completely compensate each other. This approach has been applied to estimating the mutual inductance for symmetrical and asymmetrical microstrip lines.

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Section: Symmetrical Microstrip Structurementioning

confidence: 67%

Section: Asymmetrical Microstrip Structurementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Symmetrical Microstrip Structurementioning

confidence: 99%

Section: Asymmetrical Microstrip Structurementioning

confidence: 99%

See 3 more Smart Citations

Method of Edge Currents for Calculating Mutual External Inductance in a Microstrip Structure

Koledintseva¹,

Drewniak²,

Doren³

et al. 2008

PIER

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EMI of printed circuit board and its modeling

Tanaka

Kayano

Inoue

2005

Electron. Comm. Jpn. Pt. I

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SUMMARYMeasurement and modeling of the undesired electromagnetic waves (electromagnetic noise) from electronic devices play an important role in the understanding of EMI problems and in establishing design techniques. One of the methods of analysis of the EMI problems of electronic devices is the measurement of the common mode current flowing in the cables connected to the electronic devices. This paper reviews the measurement of the common mode current on printed circuit boards (PCB) and discusses results related to the EMI problems of PCB. FDTD modeling of the common mode current by traces placed near the PCB edge and suppression of the common mode current by the guard band are described.

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Common-mode inductance and radiation of edge placed differential traces on printed circuited board

Xiao

Murano

Tayarani

et al. 2003

Asia-Pacific Conference on Environmental Electromagnetics, 2003. CEEM 2003. Proceedings.

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With respect to the single-ended trace, drfferential signaling is much advantageous to the signal integriv and common-mode radiation level reduction. However. to guarantee the required signal transmission, the two traces in the differential pair should be perfectly balanced. Edged placement of a differential pair on the PCB causes balance disruption and creates common-mode (CM) currents resulting in anincreased electromagnetic interference level. In this work, the CM inductance and radiation from differential traces with edge placement are quantified. The common-mode inductance of edged-placed differential pair on PCB is derived. Then the characteristics of the common-mode inductance of diferential pair are studied for different geometries. Finally, the total radiation powers for several geometries due to the edge placement of the differential-pair are measured.

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Common-mode currents generated by circuits on a PCB-measurements and transmission-line calculations

Cited by 12 publications

References 20 publications

Method of Edge Currents for Calculating Mutual External Inductance in a Microstrip Structure

Method of Edge Currents for Calculating Mutual External Inductance in a Microstrip Structure

EMI of printed circuit board and its modeling

Common-mode inductance and radiation of edge placed differential traces on printed circuited board

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