Compact 3 × 1 Matrix Converter Module Based on the SiC Devices with Easy Expandability

Abstract

This paper discusses a new approach for building a compact all-in-one matrix converter module based on SiC semiconductors arranged in a common source connection. The used transistors are in the D2PAK package. The design of the module is divided into two parts, namely a power module designed at one-layer aluminum substrate printed circuit board (PCB) to ensure good thermal performance and voltage isolation between the module and heatsink. The second board is responsible for the SiC driving and is mounted at the top of the power PCB and consists of metal-oxide semiconductor field effect transistor (MOSFET) drivers, isolated power supplies, a current direction detection circuit, and current value sensors. In the paper, the proper function of the SiC MOSFET drivers, current direction detection, and current measurement sensors were evaluated. Finally, 3D design together with the final prototype is presented. The modules contain three bidirectional cells for interconnection three input voltage sources and one output phase. The uniqueness and novelty of the presented module are the compactness and easy expandability of the module to achieve higher power outputs and multiphase applications such as five phase machines.

Special Issue on Power Converters: Modelling, Control, and Applications

“…Górecki and Górski [8] proposed a new form of a compact electrothermal model of impulse transformers taking into account electrical, thermal, and magnetic phenomena occurring in the considered device. Resutík and Kašcák [9] discussed a new approach for building a compact all-in-one matrix converter module based on SiC semiconductors arranged in a common source connection suitable for use in matrix converter applications.…”

“…Summarizing the first Special Issue edition, papers [1,5,7,9] referred to the design and modelling of the inverters including motor drives, papers [3,4] concerned the implementation of renewable energy sources, papers [2,3,6] described DC/DC converters and their control, and [2] was devoted to the electromagnetic compatibility of the power factor corrector, and paper [8] presented electrothermal model of the components of the power converters. All the expected key areas were presented in the first Special Issue.…”

Practical Implementation of the Indirect Control to the Direct 3 × 5 Matrix Converter Using DSP and Low-Cost FPGA

“…This paper presents the practical implementation of the indirect control of the direct topology of the matrix converter. For the power part, the compact modules presented in [ 27 ] are used to build the matrix converter in the 3 × 5 configuration. For control purposes, the control algorithm is developed on two systems, the DSP from Texas Instruments, which measures voltages and currents, calculates the duty cycles, and recognizes sectors, and the second system interconnected with DSP, based on the low-cost, low-power FPGA from Lattice Semiconductors, which applies vectors and performs fast calculations, such as matrix multiplying and executing the commutation algorithm, which is very important in the matrix converter.…”