Compact 5G n77 Band Pass Filter with Through Silicon Via (TSV) IPD Technology

Shin, Ki R.; Arendell, Jennifer; Eilert, Kim

doi:10.1109/wamicon.2019.8765433

Cited by 18 publications

(2 citation statements)

References 5 publications

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“…TSV provides low loss vertical electrical connection, so it has been widely studied in recent years [7][8][9][10][11]. and it has the advantages of lower loss, smaller size, integrability and good transmission characteristics [12][13][14][15][16][17][18], which makes it not only was used as a vertical interconnect in 3D-IC, but also widely used in the passive device manufacturing [19][20][21][22][23]. In this paper, a miniature TSV based branch line coupler for S-band is proposed.…”

Section: Introductionmentioning

confidence: 99%

A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line

Wang

Xiao

Yin

et al. 2022

IEICE Electron. Express

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A miniaturized lumped element branch line coupler with πtype equivalent circuit is proposed, the design of branch line coupler has been carried out for S-band. The lumped element in the branch line coupler is realized by TSV, and the coupler is simulated and verified by industrial simulation software HFSS. The results show that the return loss is greater than 19 dB, the isolation is better than 20 dB, and the insertion loss is less than 1.53 dB at the frequency of 2.1-2.4 GHz. The size of the miniature TSV-based branch line coupler is only 0.660×0.630mm 2 (0.018×0.017λg 2 ).

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Section: Introductionmentioning

confidence: 99%

A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line

Wang

Xiao

Yin

et al. 2022

IEICE Electron. Express

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“…16,17 Unfortunately, they cannot meet the miniaturization requirement of frontend circuits. Nowadays, 5G wideband filters rely mainly on low-temperature co-fired ceramics (LTCC) 18 and integrated passive devices (IPD) 19,20 technologies. However, LTCC and IPD filters have large size and poor IL performance compared with BAW filters.…”

Section: Introductionmentioning

confidence: 99%

A novel wideband multi‐mode coupled resonator filter based on bulk acoustic wave technology

Xie

et al. 2021

Int J RF Mic Comp-Aid Eng

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This paper proposes a novel multi-mode bulk acoustic wave (BAW) coupled resonator filter (CRF) for wideband applications. Three stepped-impedance coupling layers of CRF are used to generate multi-mode properties, and external inductors are added for port match. To facilitate the calculation of resonance frequencies, a simplified Mason model is derived and applied in the even-and odd-mode analysis of CRF. Based on different acoustical length of CRF coupling layers, four cases that are applicable for different filter bandwidth are proposed. From these cases, fractional bandwidth (FBW) of the multi-mode CRF can be realized in a wide range from 12.8% to 33% when the coupling layers adopt the commonly used SiO 2 /Mo/SiO 2 materials. Moreover, the tuning range of FBW can be further enlarged by changing the materials of coupling layers. To verify the proposed multi-mode CRF, a triple-mode n77 band filter with center frequency of 3.723 GHz and FBW of 24.2%, and a penta-mode filter with a larger FBW up to 33% are designed and simulated.Simulation results of the original Mason model, the simplified Mason model, and the three-dimensional (3D) model based on the finite element method are consistent well with each other.

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Study of the Radio Frequency (RF) performance of a Wafer-Level Package (WLP) with Through Silicon Vias (TSVs) for the integration of RF-MEMS and micromachined waveguides in the context of 5G and Internet of Things (IoT) applications: Part 1—validation of the 3D modelling approach

Iannacci

2020

Microsyst Technol

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Compact 5G n77 Band Pass Filter with Through Silicon Via (TSV) IPD Technology

Cited by 18 publications

References 5 publications

A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line

A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line

A novel wideband multi‐mode coupled resonator filter based on bulk acoustic wave technology

Study of the Radio Frequency (RF) performance of a Wafer-Level Package (WLP) with Through Silicon Vias (TSVs) for the integration of RF-MEMS and micromachined waveguides in the context of 5G and Internet of Things (IoT) applications: Part 1—validation of the 3D modelling approach

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