Compact and Broadband 300 GHz Three-Element on-chip Patch Antenna

Pfahler, Tim; Vossiek, Martin; Schür, Jan

doi:10.1109/rws55624.2023.10046297

Cited by 9 publications

(3 citation statements)

References 9 publications

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“…The upcoming sub-terahertz communication standard IEEE 802. 15.3d in the 300 GHz frequency band provides broadband communication channels for high data-rate exchange in close-proximity communications or intra-device links, thus system solutions have to be developed to utilize this standard [7], [12]. Due to small wavelengths at frequencies beyond 220 GHz, whole system-on-chip (SoC) solutions with receiver and transmitter chains, as well as integrated antennas can be developed [3], [6].…”

Section: Introductionmentioning

confidence: 99%

“…A key component of the system's performance is the design and integration of antennas on-chip. However, a bulky antenna has to be integrated into the expensive IC area, while offering poor radiation efficiency and, thus, low antenna gain due to the chips's naturally low substrate height in the BEOL stackup of the IC processes [14], [15]. This low antenna gain can be compensated for using dielectric lenses, or localized backside etching [1], [7], [16].…”

Section: Introductionmentioning

confidence: 99%

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Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz

Pfahler,

Breun,

Engel

et al. 2024

Preprint

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This paper presents a broadband low-loss fanin wafer level ball grid array (WLB) vertical through-moldvia (TMV) interconnect that enables highly integrated systemin-package (SiP) applications beyond 220 GHz. The dedicate advantage of the proposed approach is to further minimize the separation between package components (e.g., antenna in package (AiP)) and on-chip receiver or transmitter chain. To demonstrate the robustness of the TMV interconnect design, the necessity for co-simulation of the integrated circuit (IC) package and the IC itself during the package-design is shown. Therefore, an in-depth analysis of the suppression of parasitic mode oscillation inside silicon is carried out. Furthermore, the parasitic radiation loss at the TMV interconnect discontinuity is given and a verification of the proposed TMV due to high agreement of simulation and measurement results is demonstrated. The interconnect has been verified with a measured 10 dB return loss bandwidth of 38 GHz and a de-embedded insertion loss of less than 2.8 dB at 275 GHz, which enables a compact low-loss broadband signal transition from active IC components in the backend-of-line (BEOL) to passive components in package. Compared to fan-out WLB, the developed fanin WLB solution enables higher integration density of active and passive components with the shortest interconnects for minimal insertion loss. Thus, the proposed fan-in TMV packaging provides a very compact, easy-to-assemble and cost-efficient alternative for SiP designs for future broadband communication and sensing solutions.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz

Pfahler,

Breun,

Engel

et al. 2024

Preprint

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“…The array is formed by three rectangular patches in the top metallization layer, with the ground plane in the lowest layer. Reference [ 17 ] presents a 300 GHz three-element on-chip patch antenna for applications in broadband Sub-THz communication and high-resolution radar sensing. The practical interest regarding the three-element array case also suggested the investigation of the possibility of removing the undesired e.m. coupling among its elements [ 18 ].…”

Section: Introductionmentioning

confidence: 99%

A Flexible Design Strategy for Three-Element Non-Uniform Linear Arrays

Quirini

Filippini

Bongioanni

et al. 2023

Sensors

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This paper illustrates a flexible design strategy for a three-element non-uniform linear array (NULA) aimed at estimating the direction of arrival (DoA) of a source of interest. Thanks to the spatial diversity resulting from non-uniform sensor spacings, satisfactory DoA estimation accuracies can be achieved by employing a very limited number of receiving elements. This makes NULA configurations particularly attractive for low-cost passive location applications. To estimate the DoA of the source of interest, we resort to the maximum likelihood estimator, and the proposed design strategy is obtained by constraining the maximum pairwise error probability to control the errors occurring due to outliers. In fact, it is well known that the accuracy of the maximum likelihood estimator is often degraded by outliers, especially when the signal-to-noise power ratio does not belong to the so-called asymptotic region. The imposed constraint allows for the defining of an admissible region in which the array should be selected. This region can be further modified to incorporate practical design constraints concerning the antenna element size and the positioning accuracy. The best admissible array is then compared to the one obtained with a conventional NULA design approach, where only antenna spacings multiple of λ/2 are considered, showing improved performance, which is also confirmed by the experimental results.

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