2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD) 2023
DOI: 10.1109/ispsd57135.2023.10147498
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Compact GaN Power ICs with Power HEMT, Gate Driver, Temperature Sensor, Current Sense-FET and Amplifier

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Cited by 4 publications
(2 citation statements)
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“…This is a possible explanation for why the sensor gain differs by around 30% between the positive and negative current phases. In a previous work, a GaN half-bridge with integrated current-mirror sensors (similar to this work, but not in a three-phase configuration) from a more stable normally-off wafer run was experimentally characterized [ 64 ], and showed a good match of theoretical and measured current ratio. Thus, a higher sensor sensitivity, more close to the theoretical values, can be expected when fabricating future ICs with a more stable technology.…”
Section: Resultsmentioning
confidence: 72%
See 1 more Smart Citation
“…This is a possible explanation for why the sensor gain differs by around 30% between the positive and negative current phases. In a previous work, a GaN half-bridge with integrated current-mirror sensors (similar to this work, but not in a three-phase configuration) from a more stable normally-off wafer run was experimentally characterized [ 64 ], and showed a good match of theoretical and measured current ratio. Thus, a higher sensor sensitivity, more close to the theoretical values, can be expected when fabricating future ICs with a more stable technology.…”
Section: Resultsmentioning
confidence: 72%
“…One bond pad for each source of the sense-HEMTs forms the electrical interface to external readout circuits. The IC also integrates an isolated temperature sensor (resistive gold–metal meander trace [ 63 ], two bond pads), and a monolithic differential amplifier (five bond pads) as in [ 64 ]. The integrated one-stage differential amplifier is not used in this work, but can be extended to a multi-stage and high-gain integrated amplifier circuit as was experimentally demonstrated in [ 41 ] for current-sensing purposes.…”
Section: Materials and Methodsmentioning
confidence: 99%