Compact modeling approach for microchannel cooling and its validation

Németh, Márton; Takács, Gábor; Jani, Lazar; Poppe, A.

doi:10.1007/s00542-017-3330-z

Cited by 6 publications

(2 citation statements)

References 22 publications

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“…By comparing its results with measurements, it was shown that the average error introduced by the model is below 10%. In [23], the authors suggested using a time-variant resistor model to describe the convective heat transfer in heated microchannels. The authors validated their model against Ansys Fluent and obtained an error of 5%.…”

Section: Introductionmentioning

confidence: 99%

Compact Thermal Modelling Tool for Fast Design Space Exploration of 3D ICs with Integrated Microchannels

Zając

2020

Energies

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Integrated microchannel cooling is a very promising concept for thermal management of 3D ICs, because it offers much higher cooling performance than conventional forced-air convection. The thermo-fluidic simulations of such chips are usually performed using a computational fluid dynamics (CFD) approach. However, due to the complexity of the fluid flow modelling, such simulations are typically very long and faster models are therefore considered. This paper demonstrates the advantages of TIMiTIC—a compact thermal simulator for chips with liquid cooling—and shows its practical usefulness in design space exploration of 3D ICs with integrated microchannels. Moreover, thermal simulations of a 3D processor model using the proposed tool are used to estimate the optimal power dissipation profile in the chip and to prove that such an optimal profile allows for a very significant (more than 10 °C) peak temperature reduction. Finally, a custom correlation metric is introduced which allows the comparison of the power distribution profiles in terms of the peak chip temperature that they produce. Statistical analysis of the simulation results demonstrates that this metric is very accurate and can be used for example in thermal-aware task scheduling or dynamic voltage and frequency scaling (DVFS) algorithms.

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Section: Introductionmentioning

confidence: 99%

Compact Thermal Modelling Tool for Fast Design Space Exploration of 3D ICs with Integrated Microchannels

Zając

2020

Energies

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“…The effect of pin fin geometry was numerically analyzed by Jadhav et al in terms of the Nusselt number and pressure drop and observed that the elliptical pin fins experience minimum pressure drop. Németh et al developed a compact model to represent the convective heat transfer with a particular resistor network for thermal management of 3D ICs. Passive cooling equipment like micro–heat pipe device was experimentally investigated by Hamidnia et al for thermal management of microelectronics packages.…”

Section: Introductionmentioning

confidence: 99%

Performance analysis of microchannel with different pin fin layouts

Jadhav¹,

Pawar²

2019

Int J Numerical Modelling

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A numerical analysis is carried out in this study to understand the effect of the different pin fin layouts in the microchannel heat sinks. The performance analysis is done using the conjugate heat transfer module of COMSOL Multiphysics software. Initially, a microchannel with elliptical pin fins of 500-μm fin height in it is validated with the results from the literature. Further, the performance of microchannels with three different pin fin layouts is compared with the baseline model. The investigation is done for different coolant inflow velocities, keeping the channel and pin fin dimensions constant, and the results are presented in terms of the Nusselt number and pressure drop. The highest value of 19.287 Nusselt number is obtained for case b with a maximum inlet velocity of 1 m/s. A maximum increment of 16.8% and a minimum increment of 11.1% in the Nusselt number is observed in case d and case a, respectively, with 0.2 m/s inlet velocity. The minimum value of the pressure drop is observed in case d. From the results obtained in this study, it is concluded that a staggered pin fin orientation in the microchannel enhances the thermal performance better than inline arrangement. K E Y W O R D Smicrochannel heat sink, numerical analysis, Nusselt number, pressure drop, pin fin layout

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