2005
DOI: 10.1016/j.jcrysgro.2004.11.176
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Comparative analysis of electronic structure of and surfaces

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Cited by 20 publications
(7 citation statements)
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“…Such a rapid progress in the development of LiNbO 3 device has been enabled by various engineering efforts to exclude many intrinsic problems in LiNbO 3 materials, and one of these problems is a DC-drift [1][2][3]. Electrical relaxation phenomena originating from the dielectric nature of the material systems used, which is a possible origin of DCdrift in the device are known to be significantly reduced by adopting a proper buffer layer over the waveguides and also by decreasing proton impurities in the LiNbO 3 wafer [4][5][6][7].…”
Section: Introductionmentioning
confidence: 99%
“…Such a rapid progress in the development of LiNbO 3 device has been enabled by various engineering efforts to exclude many intrinsic problems in LiNbO 3 materials, and one of these problems is a DC-drift [1][2][3]. Electrical relaxation phenomena originating from the dielectric nature of the material systems used, which is a possible origin of DCdrift in the device are known to be significantly reduced by adopting a proper buffer layer over the waveguides and also by decreasing proton impurities in the LiNbO 3 wafer [4][5][6][7].…”
Section: Introductionmentioning
confidence: 99%
“…From the Nb 3d spectra (Figure b), we note that C-LNO-NCM811 exhibited characteristic peaks at 206.8 and 209.9 eV, mainly arising from pentavalent Nb 5+ , with traces of tetravalent Nb 4+ (208.4 eV) and trivalent Nb 3+ (210.5 eV) . In contrast, additional peaks of Nb 3+ and Nb 4+ were dominant in the spectrum of A-LNO-NCM811, likely due to the disordered bonding with short-range crystal ordering in the amorphous LiNbO 3 phase . Furthermore, A-LNO-NCM811 exhibited additional oxidation states in the O 1s spectra as a result of its amorphous nature, as is evident in Figure c.…”
Section: Resultsmentioning
confidence: 97%
“…In addition ARXPS investigations proved that this oxidation/reduction is an interface and not a surface effect. Thus, a thermal treatment of 400 °C for 30 min is assumed to provide the necessary activation temperature/energy for an (accelerated) diffusion process within the interface leading to an oxidation of Ti using the oxygen from the substrate and thereby reducing the Nb‐O x and Ta‐O x bondings to within the substrate …”
Section: Resultsmentioning
confidence: 99%
“…However, 400 °C seems to be a critical activation temperature, because at this point a reduction of the substrate‐metal occurs parallel to an oxidation of Ti. This is assumed to be because of a beginning (accelerated) diffusion of the Ti atoms within the interface …”
Section: Discussionmentioning
confidence: 99%