Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/ENEPIG solder joints under extreme temperature thermal shock

Tian, Ruyu; Tian, Yanhong; Huang, Yongjun; Yang, Dongsheng; Chen, Cheng; Sun, Huhao

doi:10.1007/s10854-021-05395-7

Cited by 19 publications

(6 citation statements)

References 40 publications

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“…The surface treatment process plays a key role in printed circuit board (PCB) reliability as the copper circuit is prone to be oxidated and corroded [1,2] . Electroless nickel electroless palladium immersion gold (ENEPIG) is commonly used as the ideal surface treatment process of PCB for its advantages of good atness, solderability, corrosion and wear resistance [3,4] . The ENEPIG process mainly uses the electroless plating method to prepare nickel-phosphorus (Ni-P) coating on the surface of copper circuits rst, and then uses galvanic replacement plating or electroless plating to deposit palladium and gold coatings on the Ni-P coating to further improve the corrosion resistance, wear resistance and solderability [5,6] .…”

Section: Introductionmentioning

confidence: 99%

Cobalt layer prepared on copper using galvanic replacement as an alternative to palladium for activating electroless Ni-P plating

Hu,

Li,

Liao

et al. 2024

Preprint

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Electroless nickel-phosphorus (Ni-P) plating is a widely used surface treatment method due to its excellent corrosion and wear resistance properties. However, the inertness of copper to hypophosphite oxidation necessitates a palladium activation process for the preparation of Ni-P coating on copper. In this study, we present a convenient approach for the deposition of a cobalt layer on copper using galvanic replacement, facilitated by the special complexing ability of iodide. The results demonstrated that the actual potential of copper could be adjusted to be lower than that of cobalt in a solution containing 8 mol/L NaI, enabling the deposition of a cobalt layer on copper in 15 minutes at 90°C. Furthermore, the deposition rate of the cobalt layer was found to increase with the concentration of CoCl2 in the NaI solution. Importantly, the Ni-P coating obtained through cobalt layer activation exhibited morphology, structure, and corrosion resistance, friction resistance similar to the Ni-P coating obtained using the common palladium activation. Therefore, the cobalt layer prepared on copper through galvanic replacement may serve as a viable alternative to palladium for activating electroless Ni-P plating.

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Section: Introductionmentioning

confidence: 99%

Cobalt layer prepared on copper using galvanic replacement as an alternative to palladium for activating electroless Ni-P plating

Hu,

Li,

Liao

et al. 2024

Preprint

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“…Compared to organic solderability preservatives and electrolessnickel/immersion-gold (ENIG) surface finish, ENEPIG surface finishes have several advantages. [20][21][22][23][24][25][26] First, the Au and Pd layers prevent electrode oxidation and enhance wettability. Second, the production cost is reduced because the Au layer thickness can be reduced due to the inserted Pd layer.…”

Section: Introductionmentioning

confidence: 99%

Intense Pulsed Light Soldering of Sn–3.0Ag–0.5Cu Ball Grid Array Component on Au/Pd(P)/Ni(P) Surface‐Finished Printed Circuit Board and Its Drop Impact Reliability

Min

Lee

et al. 2023

Adv Eng Mater

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“…With the increase in thermal shock cycles, the fracture mode of the SAC305/ENIG joints switched from ductile to ductile-brittle mixed fracture mode, while the fracture mode of the SAC305/ENEPIG joints was consistently ductile. Chi et al [23] found two layers of IMCs with compositions of (Au 0.30 Ni 0.70 )(Sn 0.90 Bi 0.10 ) 4 and Ni 3 Sn 4 were formed at the Sn-58Bi solder/ENIG finish interface of the aged joints, and the relationship between ball shear strength(S) and thickness(X) of (Au 0.30 Ni 0.70 )(Sn 0.90 Bi 0.10 ) 4 IMC layer: S = 7.13−0.33X was researched. Chen et al [24] only detected NiSn IMC at the Sn-58Bi/Ni interface and found that the growth of IMC followed diffusion-controlled kinetics.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Microstructure and Mechanical Reliability of Sn-58Bi/ENEPIG Solder Joints

et al. 2022

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The 42 wt.% Sn–58 wt.% Bi (Sn-58Bi) Ball Grid Array (BGA) solder balls were mounted to electroless nickel-electroless palladium-immersion gold (ENEPIG) pads by employing the reflow process profile. The effects of reflow cycles and aging time on the interfacial microstructure and growth behavior of intermetallic compounds, as well as the mechanical properties, were investigated. Pd-Au-Sn intermetallic compound (IMC) was formed at the Sn-58Bi/ENEPIG interface. With the increase in reflow cycles and aging time, the IMC grew gradually. After five reflow cycles, the shear strength of the Sn-58Bi/ENEPIG solder joints first decreased and then increased. After 500 h of aging duration under −40 °C, the shear strength of the Sn-58Bi/ENEPIG solder joints decreased by about 12.3%. The fracture mode transferred from ductile fracture to ductile and brittle mixed fracture owing to the fact that the fracture location transferred from the solder matrix to the IMC interface with the increase in reflow cycles and aging time.

show abstract

Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/ENEPIG solder joints under extreme temperature thermal shock

Cited by 19 publications

References 40 publications

Cobalt layer prepared on copper using galvanic replacement as an alternative to palladium for activating electroless Ni-P plating

Cobalt layer prepared on copper using galvanic replacement as an alternative to palladium for activating electroless Ni-P plating

Intense Pulsed Light Soldering of Sn–3.0Ag–0.5Cu Ball Grid Array Component on Au/Pd(P)/Ni(P) Surface‐Finished Printed Circuit Board and Its Drop Impact Reliability

Interfacial Microstructure and Mechanical Reliability of Sn-58Bi/ENEPIG Solder Joints

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