A method to perform fast transient simulations of interconnects by modelling the impulse responses of the S-parameters as discrete impulses, and then retaining only those with significant magnitudes has recently been shown to be faster than the present state-of-the-art method of curve fitting to a rational function model. An improvement to the fast convolution method by first optimising the choice of reference impedance used in the dataset is proposed. The method is seen to yield computational savings while retaining the accuracy.Introduction: The increase in signal frequency in high-speed electronics has placed signal integrity analysis at the forefront of the design of modern devices. At the same time, an increase in the density and complexity of the interconnects has made their analysis more challenging [1]. Presently, the state-of-the-art on interconnect simulations relies on finding a macromodel, often in the form of a rational function, which is then used to speed up the time-domain convolution to obtain the overall transient response of the circuit [2, 3]. However, recently, it has been shown that when S-parameters are used to represent the interconnects, taking a regular inverse fast Fourier transform (IFFT) and performing the convolution can be even faster, since the impulse response decays rapidly and thus only a small number of points needs to be retained in the convolution [4]. In this Letter, we show that this fast S-parameter convolution method can be further improved by first optimising the choice of reference impedance used in the S-parameters.