Comparative Study of Crosstalk Reduction Techniques in RF Printed Circuit Board Using FDTD Method

Packianathan, Rajeswari; Srinivasan, Raju

doi:10.1155/2015/294590

Cited by 7 publications

(1 citation statement)

References 13 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…As a result, the impedance spike was reduced by around 20 Ω, and the S-parameters were improved by up to 10 GHz. Methods of introducing additional structures (stub, double stub) to the microstrip in order to reduce crosstalk are addressed in [6]. Compared to parallel microstrip lines, the double-stub microstrip lines reduced the FEXT by more than 35% but increased the NEXT by more than 12%.…”

Section: Introductionmentioning

confidence: 99%

Crosstalk Reduction in High-Density Radio Frequency Printed Circuit Boards: Leveraging FR4 Coating Layers

Barzdenas,

Vasjanov

2023

Coatings

View full text Add to dashboard Cite

The escalating component density in radio frequency (RF) systems presents a growing challenge related to the coupling of adjacent microstrip lines in high-density printed circuit boards (PCBs). As a result, to tackle this prominent issue, there is a continuous pursuit of innovative techniques to effectively minimize the coupling effects among closely spaced microstrip lines. This paper proposes a reduction in the coupling of adjacent lines by utilizing a coating (stiffener) layer, which is commonly used in rigid-flex PCB fabrication. For this purpose, a reference 50 Ohm coupled line performance was compared to three coupled lines with track widths of 1.39 mm, 1.30 mm, and 1.25 mm, respectively, all at a fixed distance between the tracks. These decreasing widths were used to achieve the same 50 Ohm impedance for the coupled lines when covered with different coating layers. Each of these three coupled lines was covered with different coating (stiffener) layers, measuring 0.1 mm, 0.3 mm, and 0.5 mm in thickness, respectively. The manufactured device under test (DUT) structures underwent time-domain reflectometry (TDR) and S-parameter measurements. The TDR measurements of the DUT structures with coating layers demonstrated excellent conformity to the 50 Ohm reference coupled line. Meanwhile, the S21 measurements indicated a significant decrease in the crosstalk. For example, for a coating layer thickness of 0.3 mm, the crosstalk decreased by approximately 5–6 dB within the frequency range up to 5 GHz. When the coating layer thickness was 0.5 mm, the crosstalk decreased by approximately 10 dB or more.

show abstract

Section: Introductionmentioning

confidence: 99%