2019
DOI: 10.1364/ome.9.003452
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Comparative study of dielectric coating materials for micro-cavity applications

Abstract: We study the potential of common dielectric coating materials used for the fabrication of high reflectance mirrors in micro-cavity devices used in the visible region. We examine materials grown using E-beam and thermal evaporation and magnetron sputtering. The refractive indices and the extinction coefficients of the coatings were calculated from transmission and reflectance spectrophotometric data. The surface roughness of single layer coatings was measured using atomic force microscopy and the scatter of the… Show more

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Cited by 13 publications
(6 citation statements)
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References 59 publications
(63 reference statements)
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“…The "k" curve for the ZrO 2 increases with decreasing wavelength, which is more typical of defect-induced (Urbach) absorption in dielectric films and is comparable with those reported in Ref. [40]. indicating that the HfO 2 -based and ZrO 2 -based CMOS inverters have excellent electrical transfer characteristics and both pFET and nFET in the CMOS inverters functioned very well.…”
Section: Methodssupporting
confidence: 84%
“…The "k" curve for the ZrO 2 increases with decreasing wavelength, which is more typical of defect-induced (Urbach) absorption in dielectric films and is comparable with those reported in Ref. [40]. indicating that the HfO 2 -based and ZrO 2 -based CMOS inverters have excellent electrical transfer characteristics and both pFET and nFET in the CMOS inverters functioned very well.…”
Section: Methodssupporting
confidence: 84%
“…The low electrical conductivity is the reason that the charge accumulates in the beam-irradiated area of the dielectric surface, which in the end can lead to beam deceleration, defocusing, and even reflection from the surface. The problem of the electronbeam charging of a non-conductive surface can be partially solved by placing metal grids on the irradiated surface [96], or by admixing metals to the dielectric target to improve its electrical conductivity [97], or by introducing an auxiliary ion beam to offset the surface charge carried to the dielectric target by the electron beam [98]. Thus, conventional electronbeam processing of dielectrics requires undertaking special measures to increase the charge drainage from the surface or to prevent its accumulation.…”
Section: Electron-beam Methodsmentioning
confidence: 99%
“…When compared to other PVD processes, E-beam evaporation has a high material use efficacy, lowering the manufacturing cost. Various high-quality thin films such as stainless steel [42], copper [49], silicon [50], silicon nitride [51], and many more [52][53][54][55] have been deposited via the E-beam deposition method.…”
Section: A Vacuummentioning
confidence: 99%
“…compared to other PVD processes, E-beam evaporation has a high material use efficacy, lowering the manufacturing cost. Various high-quality thin films such as stainless steel [42], copper [49], silicon [50], silicon nitride [51], and many more [52][53][54][55] have been deposited via the E-beam deposition method. Another physical deposition method for the thin-film-coating system is pulsed-laser deposition (PLD), in which the laser beam is used to ablate the target material for depositing thin films in a vacuum chamber [56].…”
Section: A Vacuummentioning
confidence: 99%