Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability

Ismail, Norliza; Ismail, Roslina; Jalar, Azman; Omar, Ghazali; Salleh, Emee Marina; Kamil, Norinsan; Rahman, Irman Abdul

doi:10.1007/s10854-018-9410-8

Cited by 15 publications

(8 citation statements)

References 22 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Nevertheless, both investigated solders had very good wettability properties because the contact angle values were < 30°. These figures were in good agreement with many Sn-Cubased solder alloys, which are capable of low contact angle values (Ismail et al, 2018b;Hlinka et al, 2017;Arenas and Acoff, 2004;Takyi and Bernasko, 2015). In this study, the differences in the contact angle values were linked with variable parameters, i.e.…”

Section: Contact Anglesupporting

confidence: 86%

“…Flux A with the existence of "aromatic contain" functional groups decreased the surface tension and reduced the contact angles. Thus, the wettability of SAC305 and SAC305/CNT were improved (Liu et al, 2013;Ismail et al, 2018b). Therefore, from a wettability point of view, flux A contributed to better wetting properties, compared with flux B.…”

Section: Contact Anglementioning

confidence: 98%

“…Besides providing a clean oxide-free substrate surface for wetting, flux assists the spreading of the molten solder to wet and undergo a metallurgical reaction with the substrate surface. Based on Liu et al (2013) and Ismail et al (2018b), flux with "aromatic contain" created a strong non-polar interaction with solder. Thus, this strong non-polar interaction may increase the speed of the metallic component of the molten solder alloy (Sn, Ag and Cu) to react with the Cu substrate (in solid state) to form the IMC layer.…”

Section: Imc Layer Thicknessmentioning

confidence: 99%

See 2 more Smart Citations

Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu

Ismail

Jalar

Bakar

et al. 2020

SSMT

Self Cite

View full text Add to dashboard Cite

Purpose The purpose of this paper is to investigate the wettability and intermetallic (IMC) layer formation of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint according to the formulation of solder paste because of different types of fluxes. Design/methodology/approach Solder pastes were prepared by mixing SAC305 solder powder with different flux and different wt.% of carbon nanotube (CNT). Fourier transform infrared spectroscopy was used to identify functional groups from different fluxes of as-formulated solder paste. The solder pastes were then subjected to stencil printing and reflow process. Solderability was investigated via contact angle analysis and the thickness of cross-sectionally intermetallic layer. Findings It was found that different functional groups from different fluxes showed different physical behaviour, indicated by contact angle value and IMC layer thickness. “Aromatic contain” functional group lowering the contact angle while non-aromatic contain functional group lowering the thickness of IMC layer. The higher the CNT wt.%, the lower the contact angle and IMC layer thickness, regardless of different fluxes. Relationship between contact angle and IMC layer thickness is found to have distinguished region because of different fluxes. Thus it may be used as guidance in flux selection for solder paste formulation. Research limitations/implications However, detail composition of the fluxes was not further explored for the scope of this paper. Originality/value The quality of solder joint of SAC305/CNT/Cu system, as indicated by contact angle and the thickness of IMC layer formation, depends on existence of functional group of the fluxes.

show abstract

Section: Contact Anglesupporting

confidence: 86%

Section: Contact Anglementioning

confidence: 98%

Section: Imc Layer Thicknessmentioning

confidence: 99%

See 1 more Smart Citation

Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu

Ismail

Jalar

Bakar

et al. 2020

SSMT

Self Cite

View full text Add to dashboard Cite

show abstract

“…During the soldering process of the solder joint, it involved the flux reaction, which is part of the solder to assist the formation of joining. 34 The reaction of flux with CNT in the solder joint significantly influences the amount of CNT existence in the solder matrix. Hence, the amount of CNT in the solder matrix affected the electrical resistivity of solder joint.…”

Section: Resultsmentioning

confidence: 99%

Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes

Ismail

Jalar

Atiqah

et al. 2021

Nanomaterials and Nanotechnology

Self Cite

View full text Add to dashboard Cite

The main objective of this study is to investigate the electrical properties of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotube instead of solder bulk. Sn–3.0Ag–0.5Cu solder paste with the incorporation of carbon nanotube up to 0.04 wt% was fabricated by using mechanical mixing method. Fabricated solder pastes were then soldered on printed circuit board via reflow soldering at 260°C peak temperature. Electrical resistivity of Sn–3.0Ag–0.5Cu-carbon nanotube solder joints was measured by the four-point probe method at room temperature. Microstructure properties were observed by optical microscope and field emission scanning electron microscope. Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint was found to increase with the incorporation carbon nanotube up to 0.03 wt% and slightly decrease at 0.04 wt%. Incorporation of carbon nanotube in the solder matrix apparently changes the microstructure of Sn–Ag–Cu solder alloys. Microstructural observation found that electrical resistivity correlated with the distribution area of eutectic phase in the solder matrix due to the existence of carbon nanotube. It was revealed that eutectic phase area increases with the increasing of carbon nanotube wt% up to 0.03 and then slightly decreases at the incorporation of 0.04 wt% carbon nanotube as parallel with the trend of electrical resistivity values.

show abstract

“…The wettability is an important prerequisite to form a good bonding between the solder and substrate. Usually, the wettability can be characterized by spreading area and spreading ratio, and the higher of spreading ratio, the better the bonding reliability [ 19 , 20 , 21 ]. Table 1 and Figure 1 show the spreading area of Sn-20Bi-xGNS solder on Cu substrate.…”

Section: Resultsmentioning

confidence: 99%

Effect of Graphene Nanosheet Addition on the Wettability and Mechanical Properties of Sn-20Bi-xGNS/Cu Solder Joints

Yang

et al. 2020

Materials

View full text Add to dashboard Cite

Graphene nanosheets (GNSs) have an extensive application in materials modification. In this study, the effects of graphene nanosheets on the wettability of Sn-20Bi lead-free solder on copper (Cu) substrate and the growth behavior of intermetallic compound (IMC) layers at Sn-20Bi-xGNS/Cu solder joints were investigated. The experimental results indicate that the wettability of Sn-20Bi solder firstly diminished and then increased by the addition of GNSs. Meanwhile, a prism-shaped and scallop-shaped Cu6Sn5 IMC layer was clearly observed at the interface of the solder/substrate system. Moreover, it was found that a small amount of GNS addition can significantly inhibit the growth of the IMC layer at the interface as well as refine the microstructure. Additionally, by nano-indentation apparatus, it can be concluded that the hardness and elastic module of IMCs show the same variation trend, which firstly decreased and then increased. Besides, to intuitively demonstrate the reliability of IMCs, the relationship between the hardness and elastic module was established, and the ratio of hardness/elastic module (H/E) was adopted to characterize the reliability of IMCs. The results show that when the addition of GNSs was 0.02 wt%, the value of H/E is the minimum and the solder joint has the highest reliability.

show abstract

Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability

Cited by 15 publications

References 22 publications

Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu

Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu

Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes

Effect of Graphene Nanosheet Addition on the Wettability and Mechanical Properties of Sn-20Bi-xGNS/Cu Solder Joints

Contact Info

Product

Resources

About