2020
DOI: 10.1116/6.0000132
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Comparative study of thermal and radical-enhanced methods for growing boron nitride films from diborane and ammonia

Abstract: This work studies the deposition of boron/boron nitride (B/BN) composite films at low substrate temperature (275-375 °C) by alternating pulses of diborane (B 2 H 6 ) and ammonia (NH 3 ) with argon purging in between to avoid gas-phase reactions of the precursors. This process is similar to atomic layer deposition in which the dominance of surface reactions simplifies the growth mechanism. However, non-self-limiting decomposition of B 2 H 6 and incomplete nitridation lead to the incorporation of pure boron (pur… Show more

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Cited by 3 publications
(7 citation statements)
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“…The major difference with respect to the ULPCVD deposition was that the precursor in LPCVD furnace was 0.2% B2H6 in H2 gas, and the processing pressure was around 1 mbar. For B-deposition in both furnaces on patterned wafers, the thickness of the B-layer would presumably be more uniform because the deposition on thermal oxide has a much longer incubation time [132], probably because there are too few nucleation centers for B-adsorption. Therefore, gas depletion, which is responsible for thickness non-uniformity, will be reduced.…”
Section: B-deposition In the Ulpcvd Systemmentioning
confidence: 99%
“…The major difference with respect to the ULPCVD deposition was that the precursor in LPCVD furnace was 0.2% B2H6 in H2 gas, and the processing pressure was around 1 mbar. For B-deposition in both furnaces on patterned wafers, the thickness of the B-layer would presumably be more uniform because the deposition on thermal oxide has a much longer incubation time [132], probably because there are too few nucleation centers for B-adsorption. Therefore, gas depletion, which is responsible for thickness non-uniformity, will be reduced.…”
Section: B-deposition In the Ulpcvd Systemmentioning
confidence: 99%
“…The pulsed approach simplifies the growth mechanism by suppressing gas phase reactions between precursors, as discussed in our recent report. 24 The films were obtained in the pressure range of 10 −3 -0.05 mbar, at substrate temperatures between 270 and 375 °C. The typical pulse-and purge-durations were 0.5-2.5 s of the B 2 H 6 pulse, 4-6 s of post-B 2 H 6 purge, 2.5-3 s of NH 3 pulse, and 4-6 s of post-NH 3 purge.…”
Section: A Film Deposition and Characterizationmentioning
confidence: 99%
“…The films, with various compositions, were obtained either in purely thermal deposition mode or with assistance by a hot wire. 24 A reference layer of nearly stoichiometric boron nitride (ns-BN, x = 0.53 by XPS) was deposited in a Picosun R-200 reactor from the same precursors and in the same manner but by adding a plasma assistance. Reference layers of pure-B were deposited on Si by CVD from B 2 H 6 (5% in Ar) by either using (1) a constant flow of B 2 H 6 (200 SCCM) at 1 mbar and 220 °C or using (2) pulses of B 2 H 6 (a 2-s pulse every 17 s) at 10 −3 mbar and 300 °C.…”
Section: A Film Deposition and Characterizationmentioning
confidence: 99%
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