Comparative study on the thermal performance of surface‐mounted devices light‐emitting diode packaging with poly(1,4‐cyclohexylenedimethylene terephthalate) and epoxy moulding compound frames

Abstract

With the emergence of the different light-emitting diode (LED) packaging materials, the thermal analysis of LED device packaging with different materials has become urgent. The thermal performance of LED packaging with a poly(1,4-cyclohexylenedimethylene terephthalate) frame (PCT-LED) and LED packaging with an epoxy moulding compound frame (EMC-LED) were measured and simulated. The results show that compared with EMC-LED, PCT-LED has better optical and thermal performance. The luminous efficiency of PCT-LED and EMC-LED is 177.31 and 167.42 lm/W, respectively, under 150 mA at 25°C. PCT-LED devices have a lower thermal resistance of 15.64°C/W compared with that of EMC-LED, and under the different temperature and drive current conditions, the excellent thermal characteristic of PCT-LED devices is significant. Moreover, all simulation results agree well with the experimental results, and the maximum temperature of PCT-LED falls faster than that of EMC-LED with a fluid flow rate by thermal simulation. However, EMC-LED has better antiageing performance. These results are important to guide the application of PCT-LEDs and EMC-LEDs.This is an open access article under the terms of the Creative Commons Attribution-NonCommercial-NoDerivs License, which permits use and distribution in any medium, provided the original work is properly cited, the use is non-commercial and no modifications or adaptations are made.

Comparison of Optoelectronic and Thermal Properties of White Light LEDs in Ceramic Packaging and Epoxy Molding Compound Packaging

“…The physical model structure of LED devices is shown in figure 5, and the geometric model includes the LED chip, LED frame, phosphor, substrate, and heatsink. The thermal power generated by the LED chip itself is considered as the heat source, and the highest temperature obtained from the simulation is regarded as the junction temperature of the LED device [10]. Specific properties of materials, such as thermal conductivity, density, and specific heat, are required for thermal simulation [11].…”