An accurate lifetime model is needed in power electronic systems as a cost-effective means of improving reliability and performance assessment, which have long been highly desired to reduce the maintenance cost and to make the product more competitive in the market. Die-attach solder layer fatigue has been identified as one of the root causes of failure of power electronic modules. This paper presents "physics-of-failure lifetime model", which takes fatigue accumulative effect into consideration and can quantify the effect of long-term small-temperature cycling to device fatigue life cycle to estimate the lifetime of the power module. First, small T j power cycling tests were designed to obtain the effects of T j on aged and un-aged modules. They indicated that the traditional lifetime models were not accurate in predicting the lifetime of power modules. Therefore, a new time-domain crack propagation model based on the cumulative damage in the die-attach solder layer is proposed, which includes time-dependent material properties and temperature profiles. Moreover, power cycling experiments and simulations are conducted to demonstrate the method by comparing the number of cycles to failure.