2017
DOI: 10.1063/1.4979859
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Comparison of different bonding techniques for efficient strain transfer using piezoelectric actuators

Abstract: In this paper, strain transfer efficiencies from a single crystalline piezoelectric lead magnesium niobate-lead titanate substrate to a GaAs semiconductor membrane bonded on top are investigated using state-of-the-art x-ray diffraction (XRD) techniques and finite-element-method (FEM) simulations. Two different bonding techniques are studied, namely, gold-thermo-compression and polymer-based SU8 bonding. Our results show a much higher strain-transfer for the “soft” SU8 bonding in comparison to the “hard” bondin… Show more

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Cited by 13 publications
(18 citation statements)
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“…3, 6, 38, and 40. We would also like to mention that we approximated the (experimental) absolute value of p/e at F p = 0 in the performed calculations by theoretically considering a shear pre-stress of s pre xy = 200 MPa. This pre-stress, which is already present in our device at F p = 0, is a common feature and is attributed to the bonding and poling process 33,34 . However, it has no qualitative influence on the presented behavior of p/e vs S 1 + S 2 , which, obviously, purely depends on the applied stress (which is estimated from the experimental data).…”
Section: Origin Of the Dipole Inversionsupporting
confidence: 57%
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“…3, 6, 38, and 40. We would also like to mention that we approximated the (experimental) absolute value of p/e at F p = 0 in the performed calculations by theoretically considering a shear pre-stress of s pre xy = 200 MPa. This pre-stress, which is already present in our device at F p = 0, is a common feature and is attributed to the bonding and poling process 33,34 . However, it has no qualitative influence on the presented behavior of p/e vs S 1 + S 2 , which, obviously, purely depends on the applied stress (which is estimated from the experimental data).…”
Section: Origin Of the Dipole Inversionsupporting
confidence: 57%
“…This is found to be highly anisotropic (with a ratio |S 1 |/|S 2 | ≈ 3.16), applied at 55 • with respect to [100] direction and with magnitudes (S 1 + S 2 ) as high as −180 MPa (see Supplemental Material 24 ). While this stress anisotropy is not expected for the [001] piezo cut used in this work, it is a common feature reported in the literature 19,33,34 .…”
Section: Determination Of Stress Configurationsupporting
confidence: 51%
“…However, the change of the mode splitting suggests that the strain delivered by the piezo is not completely isotropic in the plane since the extremely small anisotropy = (e xx − e yy ) causes a change of each axis of around 1 nm and cannot explain the voltage-induced splitting observed in the experiment. The existence of this anisotropy is indeed consistent with previous findings [36] and it is most likely related to imperfections arising in the wafer-bonding process [37]. We note that in this scenario, a highly anisotropic strain with e xx = −0.% and e yy = 0.24% is necessary to yield a tuning range as observed in the experiment.…”
Section: (D)supporting
confidence: 91%
“…The GaAs QDs -fabricated via Al droplet etching via molecular beam epitaxy at JKU Linz -are embedded in a planar distributed Bragg reflector cavity for increasing the photoluminescence intensity. The sample substrate is thinned down to a 30 µm thick micromembrane, which is bonded on top of a micro-machined [Pb(Mg 1/3 Nb 2/3 )O 3 ] 0.72 -[PbTiO 3 ] 0.28 piezoelectric actuator [25,41,42] (for details on the sample and device fabrication see supplementary Sec. I A).…”
mentioning
confidence: 99%