2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024
DOI: 10.1109/ectc51529.2024.00367
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Comparison of Different Copper Nitride Passivation Layers Fabrication Methodology and Optimal Growth Condition for Low Temperature Copper-to-Copper Bonding in Advanced Packaging

Chiao-Yen Wang,
Tzu-Heng Hung,
Ping-Jung Liu
et al.
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