2020
DOI: 10.1016/j.solmat.2020.110487
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Comparison of different types of interfacial oxides on hole-selective p+-poly-Si passivated contacts for high-efficiency c-Si solar cells

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Cited by 40 publications
(13 citation statements)
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“…Afterward, a single-sided SiN x capping layer was deposited at 450 C using PECVD. [12,17,19] Then, the samples were subjected to the RTA processes. Finally, the samples were also subjected to 820 C N 2 annealing, 450 C N 2 annealing, and 450 C moisture/nitrogen annealing, respectively.…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…Afterward, a single-sided SiN x capping layer was deposited at 450 C using PECVD. [12,17,19] Then, the samples were subjected to the RTA processes. Finally, the samples were also subjected to 820 C N 2 annealing, 450 C N 2 annealing, and 450 C moisture/nitrogen annealing, respectively.…”
Section: Methodsmentioning
confidence: 99%
“…[8] The key structures of TOPCon SCs are comprised of an ultrathin silicon oxide (SiO x ) layer and a highly doped polysilicon (poly-Si) layer. The SiO x layer can be deposited by various methods, such as wet chemical oxidation, [3,5,9] ozone oxidation, [10,11] thermal oxidation, [11,12] plasma assistant oxidation, [12,13] and atomic layer deposition (ALD). [14,15] A high-quality SiO x layer requires a suitable thickness to provide an excellent level of chemical passivation while allowing charge-carrier-selective…”
mentioning
confidence: 99%
“…For p‐type solar cells with p‐type passivating rear contacts, work often focuses on simulation [ 12–15 ] as certain input parameters can be obtained from test structures or characterization of test structures. [ 16 ] However, the actual demonstration of a solar cell with screen‐printed metallization that comes near the determined efficiencies in simulation can be challenging, for the reasons explained earlier, resulting only in a limited amount of publications. [ 17,18 ] Alternatively, in other contributions, physical vapor deposition (PVD) is used often for rear metallization [ 19–22 ] due to the noninvasiveness of this technology.…”
Section: Introductionmentioning
confidence: 99%
“…[3] The dielectric materials, such as Al 2 O 3 and SiO X , have been attempted as alternative tunnel layers instead of a-Si:H. [18][19][20] Among them, SiO X has been successfully used in tunnel oxide passivating contact (TOPCon) solar cells. [21][22][23] The SiO X can be obtained by thermal growth in an oxygen atmosphere, [24] HNO 3 wet chemical oxidation, ozonewater wet chemical oxidation, and ultraviolet ozone (UV/O 3 ) dry chemical oxidation, etc. [25] During the thermal evaporation of MoO X , WO X , and V 2 O X , a thin layer of SiO X is formed simultaneously due to the redox reaction with Si.…”
Section: Introductionmentioning
confidence: 99%