The rutile stoichiometric phase of RuO 2 , deposited via reactive sputtering, was evaluated as a gate electrode for Si-PMOS devices. Thermal and chemical stability of the electrodes was studied at annealing temperatures of 400 C and 600 C in N 2 . X-ray diffraction patterns were measured to study grain structure and interface reactions. Very low resistivity values were observed and were found to be a strong function of temperature. Electrical properties were evaluated on MOS capacitors, which indicated that the workfunction of RuO 2 was compatible with PMOS devices. Excellent stability of oxide thickness, flatband voltage and gate current as a function of temperature was also found. Breakdown fields were also measured for the samples before and after annealing.