Comparison of Laser Chemical Processing and LaserMicroJet for structuring and cutting silicon substrates

Microstructuring and wafering of silicon with laser chemical processing

“…This would further reduce material losses. A 7 cm deep cut could already be demonstrated showing the large aspect ratio achievable with this system [25].…”

Research and application development of compound energy field processing—laser microjet

“…该技术耦 合不同激光器可以用于加工10 μm尺度的, 边缘要求较 高的场合. 目前, 该方式可加工大约5-25 mm以上厚度 的工件 [7] , 包括晶圆、太阳能硅光板的划片、切割、 划槽, 飞机涡轮叶片的气膜孔打孔等边缘要求较高的 应用场合, 主要涉及的加工对象包括不同硬度、不同 反射率的材料 [8] , 如不锈钢, Ni-Ti等金属; 硬质合金, 如立方氮化硼、聚晶金刚石、碳化钨等 [9] ; 半导体、 光电、超硬材料, 如薄硅片 [10,11] 、Diamond [12] 、 GaAs [13] 、InP等微细加工、绿色制造及医疗高附加值 的零、部件 [14] . [16,17] , 避免因水射流的不同入射角度、同轴 度、射流稳定压力、散热效率, 激光到达待加工面的 效率降低, 冲刷熔渣(气化残渣颗粒约1 μm [8] )从而影 响短脉冲激光加工效果.…”

Wafer Processing

“…First experimental results with a high power infrared Nd:YAG laser have shown that up to 7 cm of cutting depth could be reached [142]. The addition of a 10% KOH solution enhanced the cutting speed by almost an order of magnitude compared to multi-wire sawing.…”