Comparison of Mechanical Properties of Thin Copper Films Processed by Electrodeposition and Rolling

Abstract

Thin copper films with grain sizes of 31 nm and 3.3 mm were processed by electrodeposition, and their mechanical properties were compared with those of a rolled copper film. The hardness and strength for the electrodeposited copper with a grain size of 3.3 mm were lower than those of the rolled copper with a grain size of 6.3 mm, however, the elongation to failure for the former was larger than that for the latter. Intense (111) texture formation was found for the rolled copper. Therefore, it is suggested that the difference in mechanical properties between the electrodeposited and rolled copper films are related to the texture formation. The electrodeposited copper with a grain size of 31 nm showed higher strength and larger elongation than the rolled copper. The very small grain size of 31 nm gave rise to the excellent mechanical properties.

Edge Joining of A6061 Aluminum Alloy Sheets by Electrodeposition of Copper

“…Actually, although thiourea was used, the grain sizes of the present electrodeposited copper (³4 µm) were larger than those reported in the previous studies, 10,11) which perhaps comes from the fact that the current density during the electrodeposition joining was much smaller than applied in those literatures. Future studies will therefore focus on suppressing grain coarsening.…”

“…Adding thiourea to the electroplating bath increased the join strength to 214 MPa, which may be due to grain refinement in the electrodeposited copper. 10,11) As described later, the sample joined by Cu electrodeposition in the bath with thiourea fractured at the center of the electrodeposited Cu, while those joined without thiourea showed the fracture at the Al/Cu interface. The SEM image and crystallographic microstructure of the copper joint electrodeposited in the electrolyte containing thiourea are shown in Fig.…”

Virtual prototyping in a Design-for-Reliability approach

“…In many cases measurements are necessary to accurately characterize their mechanical, thermal and/or electrical properties. This is particularly important for new materials, but also for well-known materials like copper, whose properties may depend on their processing [5,6]. For instance, to simulate the thermomechanical behaviour of solder joints in surface mount assemblies, elastic, plastic and creep properties of the solder are necessary.…”