Comparison of nanometer-scale gold structures electrodeposited on Au and Pt seed electrode

Lee, Y.; Ahn, S.K.; Roh, Yonghan

doi:10.1016/j.surfcoat.2004.07.055

Cited by 9 publications

(4 citation statements)

References 19 publications

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“…In summary, the AFM micrographs and XRD patterns indicate that smooth and defect-free Au film with an ultra-fine grain size of 10.5nm can be achieved by the optimized parameters of the PE. The grain size is smaller than the values reported in previous studies [16][17][18]. For the optimized PE parameters, the pulse current is 10mA/cm 2 and the off-time current is 0mA/cm 2 .…”

Section: Resultscontrasting

confidence: 53%

Pulse electroplating of ultra-fine grained Au films with high compressive strength

Chen

Yoshiba

Nagoshi

et al. 2016

Electrochemistry Communications

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Grain refinement, surface smoothening, and compressive strength enhancement of Au films were achieved by pulse electroplating using non-toxic sulfite-based electrolyte. The estimated grain size of the Au film prepared by pulse electroplating was 10.5nm, and it was much smaller than the grain size of the Au film prepared by constant-current electroplating, which was 22.8nm. This can be attributed to the increase in the nucleation rate during the on-time period. The mechanical strength of the Au films in micro-scale was also evaluated. The pulse electroplated Au micro-pillar acquired a high compressive strength of 800MPa, and it was larger than the constant-current electroplated micro-pillar, which was 600MPa. The high strength is presumably due to the grain-boundary strengthening known as the Hall-Petch effect. The compression test also revealed that the pulse electroplated Au micro-pillar possesses better ductility and malleability than that fabricated by constant-current electroplating.

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Section: Resultscontrasting

confidence: 53%

Pulse electroplating of ultra-fine grained Au films with high compressive strength

Chen

Yoshiba

Nagoshi

et al. 2016

Electrochemistry Communications

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“…223 The structure of the electrochemically deposited material can be tuned by the deposition current, 216 electrode potential, 147 electrolyte concentration, 216 and plating mode (pulse or DC). 224 After systematic studies, Liu et al pointed out that it was essential to select a suitable constant current (I dep ) to ensure the deposited layers were smooth and compact rather than rough or loose. 216 They found that a relatively small deposition current led to a more uniform and compact electrode, as shown in Figure 9b.…”

Section: Chemical Reviewsmentioning

confidence: 99%

Molecular-Scale Electronics: From Concept to Function

et al. 2016

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Creating functional electrical circuits using individual or ensemble molecules, often termed as "molecular-scale electronics", not only meets the increasing technical demands of the miniaturization of traditional Si-based electronic devices, but also provides an ideal window of exploring the intrinsic properties of materials at the molecular level. This Review covers the major advances with the most general applicability and emphasizes new insights into the development of efficient platform methodologies for building reliable molecular electronic devices with desired functionalities through the combination of programmed bottom-up self-assembly and sophisticated top-down device fabrication. First, we summarize a number of different approaches of forming molecular-scale junctions and discuss various experimental techniques for examining these nanoscale circuits in details. We then give a full introduction of characterization techniques and theoretical simulations for molecular electronics. Third, we highlight the major contributions and new concepts of integrating molecular functionalities into electrical circuits. Finally, we provide a critical discussion of limitations and main challenges that still exist for the development of molecular electronics. These analyses should be valuable for deeply understanding charge transport through molecular junctions, the device fabrication process, and the roadmap for future practical molecular electronics.

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“…In summary, the AFM micrographs and XRD patterns indicate that smooth and defect-free gold film with ultrafine grain size of 10.5 nm can be achieved by the optimized parameters of the PCE. The grain size is smaller than the values reported in previous studies [15][16][17]. For the optimized PCE parameters, the pulse current is 10 mA/cm 2 and the off-time current is 0 mA/cm 2 .…”

Section: Pulse-current Electrodeposition Of Ultrafine Nanocrystallinementioning

confidence: 54%

Pulse-Current Electrodeposition of Gold

Chen¹,

Yoshiba²,

Tang³

et al. 2019

Novel Metal Electrodeposition and the Recent Application

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Pulse-current electrodeposition and a sulfite-based electrolyte were used in fabrication of pure gold films. Surface of the pulse-electrodeposited gold film possessed less defect, lower roughness, smaller grain size, and denser texture when compared with the gold film prepared by constant-current electrodeposition. Microstructures and compressive yield strength of the electrodeposited gold could be controlled by regulating the pulse on-time and off-time intervals in pulse-current electrodeposition. The gold film prepared under the optimum conditions showed an average grain size at 10.4 nm, and the compressive yield strength reached 800 MPa for a pillar-type micro-specimen having dimensions of 10 μm × 10 μm × 20 μm fabricated from the pulse-electrodeposited gold film. Average grain size of the pulse-electrodeposited gold film was much smaller, and the compressive yield strength was much higher than the values reported in other studies. The high strength is due to the grain boundary strengthening mechanism known as the Hall-Petch relationship. In general, the pulse-electrodeposited gold films showed yield strength ranging from 400 to 673 MPa when the average grain size varied by adjusting the pulse-electrodeposition parameters.

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Comparison of nanometer-scale gold structures electrodeposited on Au and Pt seed electrode

Cited by 9 publications

References 19 publications

Pulse electroplating of ultra-fine grained Au films with high compressive strength

Pulse electroplating of ultra-fine grained Au films with high compressive strength

Molecular-Scale Electronics: From Concept to Function

Pulse-Current Electrodeposition of Gold

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