2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2017
DOI: 10.1109/itherm.2017.7992561
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Comparison of near source two-phase flow cooling of power electronics in thermosiphon and forced convection modes

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Cited by 3 publications
(5 citation statements)
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“…by phase change, i.e., the absorption of thermal energy in the process of evaporation (liquid to vapour) and release of heat in the condensation process (vapour to liquid). A number of two-phase cooling alternatives, such as heat pipes, thermosyphon cooling and thermoelectric cooling can be highlighted [216,[244][245][246]. Heat pipe technology relies on natural forces to transfer heat.…”
Section: High Performance Air-cooling In Hev/evsmentioning
confidence: 99%
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“…by phase change, i.e., the absorption of thermal energy in the process of evaporation (liquid to vapour) and release of heat in the condensation process (vapour to liquid). A number of two-phase cooling alternatives, such as heat pipes, thermosyphon cooling and thermoelectric cooling can be highlighted [216,[244][245][246]. Heat pipe technology relies on natural forces to transfer heat.…”
Section: High Performance Air-cooling In Hev/evsmentioning
confidence: 99%
“…Thermosyphon technology achieves heat flux transfer values of around 230-240 W/cm 2 , with moderate temperature fluctuations [245]. Many efforts have been done to improve the heat dissipation capability.…”
Section: High Performance Air-cooling In Hev/evsmentioning
confidence: 99%
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“…Most of these works highlight the performance advantages of additively manufactured HXs, such as a printing resolution capability, the material used, and the different shapes that AM can fabricate. A more detailed study in the literature on the benefits of AM in thermal management devices (not only HXs) can be found in [21][22][23]. Out of the additively manufactured designs reported in Table 1, the manifold-microchannel heat exchanger (M2HX) showed the most promising results, as it could increase the heat transfer coefficient without a significant increase in pressure drop.…”
Section: Introductionmentioning
confidence: 99%
“…Battaglia et al introduced a cooling technology for power electronics based on a loop thermosyphon. The research showed that NCG can adversely affect cooling performance, but the reservoir structure helps avoid this problem [28] . These existing studies mainly focus on the effects of NCG on the performance of passive heat transfer, but they are insufficient.…”
Section: Introductionmentioning
confidence: 99%