1998
DOI: 10.1016/s0038-1101(98)00223-8
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Comparison of plasma etch techniques for III–V nitrides

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Cited by 46 publications
(18 citation statements)
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“…Gallium nitride (GaN) is an important wide and direct bandgap semiconductor which finds its applications in various optoelectronics [18][19][20]. Due to the quantum confinement effects, nanostructured devices have attracted extensive research interests for their enhanced electronic and optical properties.…”
Section: Numerical Resultsmentioning
confidence: 99%
“…Gallium nitride (GaN) is an important wide and direct bandgap semiconductor which finds its applications in various optoelectronics [18][19][20]. Due to the quantum confinement effects, nanostructured devices have attracted extensive research interests for their enhanced electronic and optical properties.…”
Section: Numerical Resultsmentioning
confidence: 99%
“…We have recently reported the effect of plasma-induced-damage on n-and p-type GaN by monitoring changes in the sheet resistance (R,) and specific contact resistance (rC)of thin conducting layers under a variety of ICP plasma conditions simulating those used during device etching [14]. Sheet resistance and specific contact resistance determined from the circular transmission line model (TLM) are used to evaluate plasmainduced-damage.…”
Section: Plasma Etching Studies Of Iii-n Materialsmentioning
confidence: 99%
“…If the wafer is tilted, which is often necessary, since for the most of materials sputter yield is maximum for incident angels between 45 0 -60 0 , the area to be etched receives proportionally less exposure. Shallow etching of fine pattern of diffractioin grating in GaN without serious mask-edge erosion [13] and over-and undercutting kept to a minimum, is possible only with thin photoresist layer and short etching times. Both examples mentioned above i.e.…”
Section: Introductionmentioning
confidence: 99%