Comparison of sliding wear behaviour of pulse electrodeposited Ni–Cu nanocrystalline alloys and Ni–Cu/Cu multilayers

Recent trends in metal alloy electrolytic and electroless plating research: a review

“…Ghosh et al 34 compared the tribological properties of nanolayered Ni-Cu/Cu (30?4 and 20?2 wt-%Cu) multilayers and nanocrystalline Ni-Cu (35?8 and 26?0 wt-%Cu) (both y10 mm) deposited by PC plating on polished stainless steel. Friction coefficients of the latter films were found to be slightly higher than those of the multilayers, although wear rates of the nanocrystalline alloys were lower.…”

“…Thus, alloy deposits have been improved by composite plating, utilising the codeposition of dispersed particles, 23,33,36,56,114,134,136 pulsed current plating, 5,7,13,27,29,31,58,88,89,90,137 deposition within a magnetic field, 128,129 multilayer deposition 4,12,24,34,37,47,57,60,65,75,80,98 followed, usually, by a post-deposition heat treatment to produce the alloy, and deposition from ionic liquids 25,72,139 to expand possible systems, e.g. Zn-Sn coatings with considerably higher Zn contents than those possible from aqueous baths.…”

“…Zn-Sn coatings with considerably higher Zn contents than those possible from aqueous baths. 25 In addition, many alloy deposition studies have made use of the enhanced properties available from nanoscale deposit grain sizes, 21,27,34,37,55,77,88,103,123,137,138 and particles 26,43,54,114,135,136 (in the case of composite plating, including CNTs).…”

“…Therefore, in the period reviewed in this paper, from 2008 to mid 2011, a sample of almost 140 studies selected by the authors is believed to be representative of the more important alloy plating papers published in the period. They feature not only improved corrosion resistance, including replacement technologies for established processes under legislative threat, such as cadmium plating, and enhanced wear resistance and hardness for tribological applications, [27][28][29][30][31][32][33][34][35][36][37][38] but also significant effort for other applications such as magnetic properties [39][40][41][42][43][44][45][46][47][48][49][50][51][52][53][54][55][56] and catalysis, membrane technology, hydrogen permeability and separation. [57][58][59][60][61][62][63][64][65][66][67][68] Further applications as diverse as batteries, conducting fabrics, whisker formation and prevention, electroforming, electrical and electronic devices, metallisation of nonand semiconductors, electromagnetic wave shielding, alloy foam production, fuel cells, hard gold and high s...…”