2010
DOI: 10.1016/j.tsf.2010.04.018
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Comparison of some coating techniques to fabricate barrier layers on packaging materials

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Cited by 79 publications
(41 citation statements)
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“…Atomic layer deposition is the fabrication method of choice, since very thin but 3D surface coatings are possible with that technique. [ 111 ] In the following, we give some examples of structures produced out of biocompatible photoresist. Although there are many biocompatible photosensitive materials, that are used for µ-printing, [ 19,33,[112][113][114] we want to exemplarily discuss structures, in which two different photoresists are combined or which consist of hollow or fl exible components.…”
Section: Progress Reportmentioning
confidence: 99%
“…Atomic layer deposition is the fabrication method of choice, since very thin but 3D surface coatings are possible with that technique. [ 111 ] In the following, we give some examples of structures produced out of biocompatible photoresist. Although there are many biocompatible photosensitive materials, that are used for µ-printing, [ 19,33,[112][113][114] we want to exemplarily discuss structures, in which two different photoresists are combined or which consist of hollow or fl exible components.…”
Section: Progress Reportmentioning
confidence: 99%
“…AlMe 3 and H 2 O were used as precursors. The ALD process parameters were selected according to our previous investigations on low-temperature ALD process for temperature-sensitive substrates [9,19,20]. Two different processing temperatures (70 ºC and 100 ºC) and three different ALD cycles (10, 50 and 100) were used to deposit the ALD coatings on the TFC PA membranes.…”
Section: Ald Coatingsmentioning
confidence: 99%
“…The nominal thicknesses of the coating was estimated based on the growth rate 0.1 nm/cycle measured from films grown on a silicon wafer with a Nanospec AFT 4150 reflectometer [19,20]. ALD coatings have shown a minor variation of the actual film thickness, because of the difference in surface chemistry and roughness of different polymers, in comparison to a silicon wafer.…”
Section: Ald Coatingsmentioning
confidence: 99%
“…The atomic layer deposition (ALD) technique has been found to be very effective compared with some other coating techniques. [7] Thin aluminum oxide and silicon dioxide coatings have been deposited on packaging materials to achieve excellent barrier properties to water and oxygen. [8,9] Laminates are made by compounding layers of high barrier property with other layers of low cost and other desirable properties.…”
Section: Introductionmentioning
confidence: 99%