Comparison of strength degradation for SnAgCu solders with various Ag contents during thermal cycling

Wang, Xiaojing; Li, Quanzhen; Zhang, Youchen; Cai, Shanshan; Hessien, Mahmoud M.; Fallatah, Ahmed M.; Liu, Ning; Yuan, Xiaohong; El-Bahy, Salah M.

doi:10.1007/s42114-024-01101-3

Adv Compos Hybrid Mater

2024

DOI: 10.1007/s42114-024-01101-3

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Comparison of strength degradation for SnAgCu solders with various Ag contents during thermal cycling

Xiaojing Wang,

Quanzhen Li,

Youchen Zhang

et al.

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Comparison of strength degradation for SnAgCu solders with various Ag contents during thermal cycling

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References 31 publications

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