2024
DOI: 10.3390/app14020604
|View full text |Cite
|
Sign up to set email alerts
|

Comparison of Tensile and Creep Properties of SAC305 and SACX0807 at Room Temperature with DIC Application

Zbynek Paska,
Radim Halama,
Petr Dymacek
et al.

Abstract: The contribution presents the verification of the methodology of accelerated creep tests from the point of view of obtaining more information about the stress–strain behaviour of the investigated materials using the Digital Image Correlation method. Creep tests are performed on SAC305 and SACX0807 lead-free solders and are supplemented by numerical modelling using the finite element method, considering the viscoplastic model based on the theory of Perzyna, Chaboche, and Norton. The stress–strain behaviour of b… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Year Published

2024
2024
2024
2024

Publication Types

Select...
1

Relationship

0
1

Authors

Journals

citations
Cited by 1 publication
references
References 35 publications
(49 reference statements)
0
0
0
Order By: Relevance