2000
DOI: 10.1016/s0261-3069(00)00038-8
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Comparison of the thermal stresses developed in diamond and advanced ceramic coating systems under thermal loading

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Cited by 21 publications
(13 citation statements)
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“…1. Two displacements of the cross-beam, 1 f  and 2 f  , will be obtained for the test sample ( Fig. 1(a)) and the reference sample ( Fig.…”
Section: Determining Ht Elastic Modulus Of Coatings On Beam Samplesmentioning
confidence: 99%
See 1 more Smart Citation
“…1. Two displacements of the cross-beam, 1 f  and 2 f  , will be obtained for the test sample ( Fig. 1(a)) and the reference sample ( Fig.…”
Section: Determining Ht Elastic Modulus Of Coatings On Beam Samplesmentioning
confidence: 99%
“…Ceramic coatings have attracted considerable attention of material scientists and mechanical engineers due to their wide applications in aerospace, aviation, energy, petrochemical, and chemical industry fields to withstand high temperature (HT) [1][2][3]. The HT ceramic coatings are used for three main functions, viz.…”
Section: Introductionmentioning
confidence: 99%
“…As the deposition temperature can reach about 950°C before the cooling process in the diamond film deposition, deposition temperature at the edge of the diamond film was set as 950°C and a radial temperature gradient of 50°C from the edge to the centre was introduced during the simulation. An ANSYS thermal analysis was carried out to calculate the temperature distribution in the model and then the whole model was cooled to room temperature using a heat transfer coefficient of 30 W/(m 2 ·K) [7]. At the same time, a coupled structural-thermal analysis was performed to compute the thermal stress distribution.…”
Section: Experimental Procedures and Finite Element Modelmentioning
confidence: 99%
“…Recently, numerical methods e.g. finite element analysis, have been accepted as attractive tools to simulate the thermal stress in coating substrate systems [5][6][7][8][9]. It is generally acknowledged that the interlayer between the diamond film and the substrate is used to enhance the adhesion of the film to substrates, reduce the thermal mismatch between them, and prevent the film from cracking [10][11][12].…”
Section: Introductionmentioning
confidence: 99%
“…Compared with regular polymer, CNTs have lower expansion coefficient, which reduces the residual stress in laminated polymer composites. Previous studies have reported that the magnitude and distribution of thermal residual stress can be adjusted by selecting the appropriate material combination and controlling the compositional gradient [4,5]. In addition, CNTs have favorable strength and stiffness and is capable of changing material properties such as electrical and thermal conductivity.…”
Section: Introductionmentioning
confidence: 99%