Comparison of thermal runaway limits under different test conditions based on a 4.5kV IGBT

Reigosa, Paula Diaz; Prindle, D.; Pâques, Gontran; Geissmann, Silvan; Iannuzzo, Francesco; Kopta, A.; Rahimo, Munaf

doi:10.1016/j.microrel.2016.07.025

Cited by 5 publications

(2 citation statements)

References 10 publications

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“…A key driver for railway rolling stock is the associated power electronics propulsion thermal management technology. This must guarantee that the high-voltage insulated-gate bipolar transistors (IGBTs), which are optimized to operate closer to their limits at increasing temperatures, work within the SOA (Safe Operation Area) [2], avoiding intense heating and burn-out. One of the widely adopted technologies for this purpose is the indirect liquid cooling system by means of liquid cold plates (LCPs).…”

Section: Introductionmentioning

confidence: 99%

DOE optimization of a liquid cold plate used in a thermal management system for power converters in the railway sector through 3D CFD analysis

De Rosa,

Romagnuolo,

Frosina

et al. 2023

J. Phys.: Conf. Ser.

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The thermal management system for power electronics is becoming a key factor in order to guarantee optimal working conditions, efficiency and safety of those components. In the field of liquid-cooled power electronics, the design of an optimal liquid cold plate (LCP) is fundamental to increase the heat transfer, minimizing the maximum temperature and the pressure drop. This work presents an optimization procedure of a finned extruded profile of an LCP for insulated gate bipolar transistor (IGBT) power module, for railway propulsion. The optimization has been performed through DOE, by considering different values of several control factors (shape of the fin, length of the fin, pitch between the channels created by the fins), in order to minimize the LCP maximum temperature and the pressure drop between inlet and outlet. The combination of different values of control factors results in 18 prototypes, which have been compared using three-dimensional CFD simulations, performed in Ansys Fluent environment. The influence of parameters variation on the objective functions (i.e. maximum temperature of the liquid cold plate and pressure drop) has been verified.

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Section: Introductionmentioning

confidence: 99%

DOE optimization of a liquid cold plate used in a thermal management system for power converters in the railway sector through 3D CFD analysis

De Rosa,

Romagnuolo,

Frosina

et al. 2023

J. Phys.: Conf. Ser.

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“…If the heat is not conducted in time, it will burn the IGBT module. Thus, it is imperative to develop effective heat-dissipating/cooling components for IGBT [ 8 , 9 ].…”

Section: Introductionmentioning

confidence: 99%

Design and Analysis of the IGBT Heat Dissipation Structure Based on Computational Continuum Mechanics

Lin

Liu

et al. 2020

Entropy

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With the trend of high integration and high power of insulated gate bipolar transistor (IGBT) components, strict requirements have been placed on the heat dissipation capabilities of the IGBT devices. On the basis of traditional rectangular fins, this paper developed two new types of heat-dissipating fins to meet the high requirements of heat dissipation for the IGBT devices. One is the rectangular radiator with a groove length of 2.5 mm and a width of 0.85 mm, the other is the arc radiator with the angle of 125 arc angle, 0.8 mm arc height, and 1.4 mm circle radius. After theoretically calculating the IGBT junction temperature, numerical simulations have been implemented to verify the theoretical result. The commercial CFD software, STAR-CCM+, was employed to simulate the heat dissipation characteristics of the IGBT module under different wind speeds, power, and fin structures. By analyzing the temperature field and vector field of the IGBT module, the analysis results demonstrate that the error between the simulation result and the theoretical calculation is within 5%, which proves the feasibility of the newly designed heat-dissipating fins. When the wind speed is 12.5 m/s, the power is 110 W, the fin height is 31.2 mm, and the fin thickness is 2.3 mm, the rectangular radiator can achieve the best heat dissipation performance.

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Increasing the Reliability of Aluminum Wirebonds by Thermal Treatments: Analysis and Implementation

Pichon

Brandelero

Lelesle

et al. 2023

IEEE J. Emerg. Sel. Topics Power Electron.

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Comparison of thermal runaway limits under different test conditions based on a 4.5kV IGBT

Cited by 5 publications

References 10 publications

DOE optimization of a liquid cold plate used in a thermal management system for power converters in the railway sector through 3D CFD analysis

DOE optimization of a liquid cold plate used in a thermal management system for power converters in the railway sector through 3D CFD analysis

Design and Analysis of the IGBT Heat Dissipation Structure Based on Computational Continuum Mechanics

Increasing the Reliability of Aluminum Wirebonds by Thermal Treatments: Analysis and Implementation

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