2012
DOI: 10.3390/s120708770
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Comparisons between Membrane, Bridge and Cantilever Miniaturized Resistive Vacuum Gauges

Abstract: Using bulk micromachining, meander-shaped resistor elements consisting of 20 nm Cr and 200 nm Au were fabricated on 1 μm thick silicon nitride membranes, bridges, and cantilevers. The resistance change as a function of pressure depends strongly on the thermal resistance of the two metal lines connecting the heated resistor to the silicon bulk (cold junction) and on the thermal resistance of the silicon nitride. Relative resistance changes ranging from about 3% (small membrane) to 20% (bridge) per mW of input p… Show more

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Cited by 12 publications
(4 citation statements)
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“…la). The gauge, consisting of a meander heater made of Crl Au bilayer, deposited onto a thin silicon nitride bridge (l000x200x 1.0 /!m) [2] has been encapsulated in a miniature glass container ( fig. 1 b).…”
Section: Methodsmentioning
confidence: 99%
“…la). The gauge, consisting of a meander heater made of Crl Au bilayer, deposited onto a thin silicon nitride bridge (l000x200x 1.0 /!m) [2] has been encapsulated in a miniature glass container ( fig. 1 b).…”
Section: Methodsmentioning
confidence: 99%
“…By miniaturizing the sensor element, new application fields are gathered. The new sensor elements are much smaller in size and are competitive 2,4,5, [11][12][13]21,[28][29][30][31][32][33][36][37][38]42,45 with or even improved 1,3, 15,17,[23][24][25]43 in sensitivity compared to conventional Pirani gauges. Many designs [6][7][8][9][10][14][15][16][17][18][19][20]22,26,34 have been developed for specific pressure ranges.…”
Section: Introductionmentioning
confidence: 99%
“…Most effective method of increasing the high pressure limit of the dynamic range is to reduce the gap between the Pirani gauge and the heat sink [6]. And the area of Pirani gauge also has an effect on the pressure range [7]. The heat loss, Q loss is mainly contributed to thermal convection through the residual gas, conduction through contacts and leads and thermal radiation between sensitive material and substrate.…”
Section: (1 )mentioning
confidence: 99%