Complete stress release in monolayer ALD-Al<sub>2</sub>O<sub>3</sub> films based on mechanical equilibrium homeostasis to realize a bending radius of 1 mm

Wang, Zhenyu; Chen, Ziqiang; Feng, Jing; Wang, Jintao; Fan, Siyu; Li, Yun‐Fei; Duan, Yu

doi:10.1039/d2sm00486k

Cited by 4 publications

(4 citation statements)

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“…Furthermore, many efforts to enhance flexibility use organic buffer layer. The organic layer not only delays the travel time of water molecules between pinholes or defects in the upper and lower inorganic layers but also compensates for film stress (σ r ), thereby enhancing the barrier property and bendability [40,71,72]. Organic layer typically includes CVD films, spin-coating polymers, MLD thin films, and inkjet printing monomers [42,[71][72][73].…”

Section: Bendable Multilayer Structuresmentioning

confidence: 99%

“…Modulating process conditions such as temperature, pulse time, pressure, and the choice of precursor species can achieve the desired filling. Moreover, ALD allows for deposition at low temperatures, a crucial requirement for encapsulating flexible electronics [40]. Importantly, in the ALD process, the uniform thin film chemically binds to the surface on the substrate, ensuring strong bonding and conformal contact between layers, ideal for interface stabilization.…”

Section: Introductionmentioning

confidence: 99%

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Advancements in atomic-scale interface engineering for flexible electronics: enhancing flexibility and durability

Wen,

Yuan,

Cao

et al. 2024

Nanotechnology

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Flexible electronics, such as wearable displays, implantable electronics, soft robots, and smart skin, have garnered increasing attention. Despite notable advancements in research, a bottleneck remains at the product level due to the prevalent use of polymer-based materials, requiring encapsulation films for lifespan extension and reliable performance. Multilayer composites, incorporating thin inorganic layers to maintain low permeability towards moisture, oxygen, ions, etc., exhibit potential in achieving highly flexible barriers but encounter challenges stemming from interface instability between layers. This perspective offers a succinct review of strategies and provides atomic-scale interface modulation strategy utilizing atomic layer integration technology focused on enhancing the flexibility of high-barrier films. It delves into bendable multilayers with atomic-scale interface modulation strategies, encompassing internal stress and applied stress modulation, as well as stretchable composite structural designs such as gradient/hybrid, wavy, and island. These strategies showcase significant improvements in flexibility from bendable to stretchable while maintaining high barrier properties. Besides, optimized manufacturing methods, materials, and complex structure design based on atomic-scale interface engineering are provided, better aligning with the future development of flexible electronics. By laying the groundwork for these atomic-scale strategies, this perspective contributes to the evolution of flexible electronics, enhancing their flexibility, durability, and functionality.

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Section: Bendable Multilayer Structuresmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Advancements in atomic-scale interface engineering for flexible electronics: enhancing flexibility and durability

Wen,

Yuan,

Cao

et al. 2024

Nanotechnology

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“…Single-layer TFE and multilayer TFE are the most common types of TFE, and a wide range of inorganic and organic materials have been utilized in TFE [8][9][10][11] . Organic materials such as AlOx, SiOx, SnOx, SiN, and TiO2 are regularly employed in single-layer film [12][13][14] . Although single-layer TFE is a simple technique with low production costs, barrier performance is restricted.…”

Section: Introductionmentioning

confidence: 99%

P‐10.1: Design and Optimization of Al₂O₃/Alucone Overlapping Film for Improved Water‐Oxygen Barrier Performance of Flexible Displays

Zhao,

Peng,

Chen

et al. 2024

Symp Digest of Tech Papers

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Thin‐film encapsulation plays an essential role in the stability of flexible displays. Although Al2O3 film has good water‐oxygen barrier properties, its bending performance needs to be enhanced. This paper inserts Alucone into Al2O3 film to generate Al2O3/Alucone overlapping film with good barrier and bending performance to improve the encapsulated devices. The finite element analyzing approach and the calcium dot arrays test are employed to investigate the influence of structural ratio and overlapping density on the water‐oxygen barrier and mechanical properties of the Al2O3/Alucone overlapping film. The results show that the proportion of Alucone sublayers in the Al2O3/Alucone overlapping film (with a total thickness of 60 nm) is directly proportional to the overlapping structure's ability to disperse stresses and inversely proportional to the overlapping structure's water‐oxygen barrier property. When the Al2O3/Alucone overlapping structure ratio is 1:1, the Al2O3/Alucone overlapping film can balance the bending and barrier properties. The bending property of Al2O3/Alucone overlapping film (Al2O3/Alucone ratio is 1:1, total thickness is 60 nm) diminishes with increasing overlapping density, and its water‐oxygen barrier property increases and then drops. Combining the results of the simulation and calcium dot arrays test, it is apparent that when the Al2O3/Alucone ratio is 1:1 and the overlapping density is 5, the Al2O3/Alucone overlapping film has good bending and barrier performance. This is expected to promote the development of commercial flexible display technology.

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“…High-performance, low-power, and small-size semiconductor devices have been intensively studied in the last decades to overcome the physical limitations of the existing system and boost computing efficiency [1][2][3] . To implement electronic products based on these emerging devices in the near future, various components that can support the devices should be developed together; for example, compact electronic devices require multi-functional materials that are lightweight and flexible but can protect them from external shocks, while quickly dissipating heat generated from the device [4][5][6][7] . A composite is a mixture of the structure and characteristics of two or more materials, and in general, the physical and chemical properties of the basic matrix can be enhanced by additive reinforcements 8 .…”

mentioning

confidence: 99%

Float-stacked graphene–PMMA laminate

Kim,

Moon,

Hyeong

et al. 2024

Nat Commun

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Semi-infinite single-atom-thick graphene is an ideal reinforcing material that can simultaneously improve the mechanical, electrical, and thermal properties of matrix. Here, we present a float-stacking strategy to accurately align the monolayer graphene reinforcement in polymer matrix. We float graphene-poly(methylmethacrylate) (PMMA) membrane (GPM) at the water–air interface, and wind-up layer-by-layer by roller. During the stacking process, the inherent water meniscus continuously induces web tension of the GPM, suppressing wrinkle and folding generation. Moreover, rolling-up and hot-rolling mill process above the glass transition temperature of PMMA induces conformal contact between each layer. This allows for pre-tension of the composite, maximizing its reinforcing efficiency. The number and spacing of the embedded graphene fillers are precisely controlled. Notably, we accurately align 100 layers of monolayer graphene in a PMMA matrix with the same intervals to achieve a specific strength of about 118.5 MPa g−1 cm3, which is higher than that of lightweight Al alloy, and a thermal conductivity of about 4.00 W m−1 K−1, which is increased by about 2,000 %, compared to the PMMA film.

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Complete stress release in monolayer ALD-Al₂O₃ films based on mechanical equilibrium homeostasis to realize a bending radius of 1 mm

Abstract: Low-temperature-deposited, transparent, high-barrier-performance atomic layer deposition(ALD) Al2O3 films are widely utilized to protect organic optoelectronic devices. However, because the internal compression residual stresses result in poor mechanical properties, these films...

Cited by 4 publications

References 34 publications

Advancements in atomic-scale interface engineering for flexible electronics: enhancing flexibility and durability

Advancements in atomic-scale interface engineering for flexible electronics: enhancing flexibility and durability

P‐10.1: Design and Optimization of Al₂O₃/Alucone Overlapping Film for Improved Water‐Oxygen Barrier Performance of Flexible Displays

Float-stacked graphene–PMMA laminate

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Complete stress release in monolayer ALD-Al2O3 films based on mechanical equilibrium homeostasis to realize a bending radius of 1 mm

Abstract: Low-temperature-deposited, transparent, high-barrier-performance atomic layer deposition(ALD) Al2O3 films are widely utilized to protect organic optoelectronic devices. However, because the internal compression residual stresses result in poor mechanical properties, these films...

Cited by 4 publications

References 34 publications

Advancements in atomic-scale interface engineering for flexible electronics: enhancing flexibility and durability

Advancements in atomic-scale interface engineering for flexible electronics: enhancing flexibility and durability

P‐10.1: Design and Optimization of Al2O3/Alucone Overlapping Film for Improved Water‐Oxygen Barrier Performance of Flexible Displays

Float-stacked graphene–PMMA laminate

Contact Info

Product

Resources

About

Complete stress release in monolayer ALD-Al₂O₃ films based on mechanical equilibrium homeostasis to realize a bending radius of 1 mm

P‐10.1: Design and Optimization of Al₂O₃/Alucone Overlapping Film for Improved Water‐Oxygen Barrier Performance of Flexible Displays