Complexing capacity of electroplating rinsing baths—a twist to the resolution of two ligand families of similar strength

Abstract

Background: The presence of ligands affects metal behavior when removing metals from wastewaters. So far, most of the attention has been paid to strong ligands; however, experimental observations indicate that also weaker complexing agents may play a key role in the availability of metals in waters and in the success of the treatment to be applied. In particular, we have analyzed wastewaters of an electroplating facility during an 8-h workday. Total metal content (copper, zinc, cadmium, and lead) was determined; ligands were characterized by concentration (Lt) and strength (conditional stability constant, K'f). This work focuses on ligands of moderate strength which, as far as we know, have been overlooked in the literature.

Tuning the wettability of metal surface with electrodeposited porous copper and graphene coatings

“…Electroplating is defined as a process of adding a thin layer to a substrate by transferring metal ions via an electrical field. Generally, it consists of a chemical solution (electrolyte), and two electrodes immersed the electrolyte, a positive electrode (anode) and a negative electrode (cathode) are connected with DC or AC electrical power supply to control operating current and voltage [72,73]. The metal to be electroplated becomes the cathode of an electrolytic cell that receives the ions that dissolve in the electrolyte.…”