Compliance-tunable thermal interface materials based on vertically oriented carbon fiber arrays for high-performance thermal management

Li, Junwei; Ye, Zhenqiang; Mo, Pingjing; Pang, Yunsong; Gao, Enze; Zhang, Chenxu; Du, Guoping; Sun, Rong

doi:10.1016/j.compscitech.2023.109948

Cited by 30 publications

(7 citation statements)

References 32 publications

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“…The thermal conductivity of OTM-GO/Al 2 O 3 /PDMS nanocomposites was isotropic; thus, the thermal dissipation model can be further simplified to The OTM-GO/Al 2 O 3 /PDMS nanocomposites were used as thermal interface materials (TIMs) for high-power CPU and LED chips to further evaluate their temperature-indicating function and heat dissipation efficiency. 46,47 The pristine PDMS was measured as the control group. As shown in Figure 5a, the CPU test system consists of circuit boards, chips, and the OTM-GO/Al 2 O 3 /PDMS nanocomposites.…”

Section: Resultsmentioning

confidence: 99%

Rapid Thermochromic and Highly Thermally Conductive Nanocomposite Based on Silicone Rubber for Temperature Visualization Thermal Management in Electronic Devices

Yan,

Cai,

Zhang

et al. 2024

ACS Appl. Mater. Interfaces

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Effective heat dissipation and real-time temperature monitoring are crucial for ensuring the long-term stable operation of modern, high-performance electronic products. This study proposes a silicon rubber polydimethylsiloxane (PDMS)-based nanocomposite with a rapid thermal response and high thermal conductivity. This nanocomposite enables both rapid heat dissipation and real-time temperature monitoring for high-performance electronic products. The reported material primarily consists of a thermally conductive layer (Al 2 O 3 /PDMS composites) and a reversible thermochromic layer (organic thermochromic material, graphene oxide, and PDMS nanocoating; OTM-GO/PDMS). The thermal conductivity of OTM-GO/Al 2 O 3 /PDMS nanocomposites reached 4.14 W m −1 K −1 , reflecting an increase of 2200% relative to that of pure PDMS. When the operating temperature reached 35, 45, and 65 °C, the surface of OTM-GO/Al 2 O 3 /PDMS nanocomposites turned green, yellow, and red, respectively, and the thermal response time was only 30 s. The OTM-GO/Al 2 O 3 /PDMS nanocomposites also exhibited outstanding repeatability and maintained excellent color stability over 20 repeated applications.

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Section: Resultsmentioning

confidence: 99%

Rapid Thermochromic and Highly Thermally Conductive Nanocomposite Based on Silicone Rubber for Temperature Visualization Thermal Management in Electronic Devices

Yan,

Cai,

Zhang

et al. 2024

ACS Appl. Mater. Interfaces

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“…The rapid advancement of intelligent electronic devices, along with their integration and high‐power density, has led to a significant concern: the accumulation of heat generated by chips, which can negatively impact operational stability and service life. Consequently, the thermal management of electronic devices has gained paramount importance 1–4 . To address this challenge, polymer‐based thermal interface materials (TIMs) reinforced with functional fillers are recognized as an effective approach for thermal management, which offer advantages, such as ease of preparation, lightweight properties, and resistance to corrosion 5–7 .…”

Section: Introductionmentioning

confidence: 99%

The improved thermal conductivity and heat dissipation capacity of elastomer‐based thermal interface materials through promoting the surface interactions and complete networks

Chen,

He,

Chen

et al. 2024

Polymer Composites

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Polymer‐based thermal interface materials (TIMs) with excellent thermal conductivity and heat dissipation capabilities play a crucial role in addressing the issue of heat accumulation in advanced integrated electronics. However, establishing improved surface interactions and complete networks to enhance efficient phonon transfer remains a significant challenge. To tackle this problem, surface modification and ice‐templating techniques are commonly employed to create the robust interface crosslinks and continuously thermal conductive pathways. Herein, 2‐mercaptobenzimidazole (MB) was used as a reducing and modifying agent to functionalize graphene oxide (rGO‐MB) within the three‐dimensional networks, which was prepared using a combination of hydrothermal and ice‐templating methods. As a result, the reduced graphene oxide/natural rubber (rGO‐MB/NR) TIMs exhibited a remarkable through‐plane thermal conductivity of 0.93 W m−1 K−1 with a filler loading of 3 wt%. The enhanced interface interactions between rGO‐MB and NR, combined with the establishment of a three‐dimensional network, significantly contributed to the improved thermal conductivity and heat dissipation capabilities. Moreover, the obtained TIMs demonstrated favorable mechanical properties (5.06 MPa, 502%) and excellent insulation performance (3 × 1013 Ω cm). These findings provide the valuable insights into potential solutions for mitigating heat accumulation issues in next‐generation electronics.Highlights rGO‐MB with thiol groups was obtained by the hydrothermal method. Interactions between rGO‐MB and NR mainly depended on the chemical bonds. rGO‐MB/NR TIMs owned the improved thermal management performance.

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“…[1,2,3] However, a major challenge in these highly integrated electric devices is the construction of efficient thermal management systems. [4,5] Particularly, dealing with the excessive DOI: 10.1002/aelm.202300455 heat buildup in electric vehicles poses a significant challenge for the industry. To address this issue and achieve effective thermal management, thermal interface materials (TIMs) such as polymer composites are employed.…”

Section: Introductionmentioning

confidence: 99%

Development Aramid Nanofiber‐ and Pentaerythritol‐Grafted Graphene Nanoplate‐Based High‐Performance Thermally Conductive Composites

Lee,

Yang,

Kim

2023

Adv Elect Materials

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A novel filler surface treatment is employed to produce thermally conductive composites using an aramid nanofiber (ANF) and pentaerythritol (PER) grafted onto the surface of graphite nanoplates (GnP). The resulting composite exhibits exceptional properties, including a high through‐plane thermal conductivity of 4 W mK−1, a high tensile strength of 163.58 MPa, and an improved flame retardancy. When the composite is applicated in central processing unit (CPU), the efficient thermal management performance is achieved with a decreased operating temperature of 12 °C. The ANF/GnP–PERANF composites are promising for enhancing thermal management in electric devices. The manufactured ANF composites will open new avenues for advancing the development of next‐generation thermal management systems.

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Compliance-tunable thermal interface materials based on vertically oriented carbon fiber arrays for high-performance thermal management

Cited by 30 publications

References 32 publications

Rapid Thermochromic and Highly Thermally Conductive Nanocomposite Based on Silicone Rubber for Temperature Visualization Thermal Management in Electronic Devices

Rapid Thermochromic and Highly Thermally Conductive Nanocomposite Based on Silicone Rubber for Temperature Visualization Thermal Management in Electronic Devices

The improved thermal conductivity and heat dissipation capacity of elastomer‐based thermal interface materials through promoting the surface interactions and complete networks

Development Aramid Nanofiber‐ and Pentaerythritol‐Grafted Graphene Nanoplate‐Based High‐Performance Thermally Conductive Composites

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