1991 Proceedings 41st Electronic Components &Amp; Technology Conference
DOI: 10.1109/ectc.1991.163951
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Complications in life prediction estimates at elevated temperatures in lead/tin solders during accelerated cycling

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Cited by 4 publications
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“…Several studies on solders are being carried out on bulk solder samples under accelerated thermal shock conditions to understand their thermomechanical fatigue behavior, and to arrive at reliability predictions. 11,12 However, in a realistic solder joint, the solder between the lead of the electrical component and the metallic substrate is under severe mechanical constraints. The mechanical behavior of the solder present in the joint under the stresses that develop due to CTE mismatches is controlled by the mechanical behavior of the constituents in the electronic package, and the intermetallic layers.…”
Section: Solder Related Issuesmentioning
confidence: 99%
“…Several studies on solders are being carried out on bulk solder samples under accelerated thermal shock conditions to understand their thermomechanical fatigue behavior, and to arrive at reliability predictions. 11,12 However, in a realistic solder joint, the solder between the lead of the electrical component and the metallic substrate is under severe mechanical constraints. The mechanical behavior of the solder present in the joint under the stresses that develop due to CTE mismatches is controlled by the mechanical behavior of the constituents in the electronic package, and the intermetallic layers.…”
Section: Solder Related Issuesmentioning
confidence: 99%