Component Packages for IMSE™ (Injection Molded Structural Electronics)

Simula, Tomi; Niskala, Paavo; Heikkinen, Mikko; Rusanen, Outi

doi:10.23919/nordpac.2018.8423845

Cited by 8 publications

(3 citation statements)

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“…Some researchers made efforts to standardize the technology. They introduced electronic packages requirements for IME, including minimum contact spacing is 500 µm, the minimum contact area is 500 µm × 300 µm, the overall height of the components should be 1 mm maximum, the moisture sensitivity level is 0 or 1, package shapes are simple, such as cuboids, cylinders or domes and all corners are rounded, and maximum package size should be 16 mm 2 [32]. Moreover, some assembly considerations were made, the thickness of the mold must be more than the component height.…”

Section: Mold Design Foil Design and Component Choicementioning

confidence: 99%

The integration of electronic circuits in plastics using injection technologies: a literature review

Bakr¹,

Bossuyt²,

Vanfleteren³

2022

Flex. Print. Electron.

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A great deal of attention has been paid in recent years to the integration of two and three-dimensional integrated electronic parts into plastics, both for their potential applications in modern human lives and for their outstanding properties, which include the ability to reduce product weight and space while increasing product reliability. The development of integrated electronic devices into plastics is advancing rapidly, owing to advancements in methodology and manufacturing techniques, which have significantly raised researcher interest in this topic. In-mold electronics (IME) is a term that describes an injection molding technology that integrates a printed foil with electrical components into a plastic part during the molding process. It is a revolutionary way to form two and three-dimensional products using electronic printed circuits. IME technology is comprised of three fundamental disciplines of study: electronics, materials science, and plastic manufacturing processes. Therefore, this review article aims to summarize the knowledge of these three primary fields to present an overview of in-mold technology. This article covers background history, a description of the In-mold process flow, and summarizes the recent real-life applications. Additionally, this article discusses some of the present technology challenges that must be overcome.

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Section: Mold Design Foil Design and Component Choicementioning

confidence: 99%

The integration of electronic circuits in plastics using injection technologies: a literature review

Bakr¹,

Bossuyt²,

Vanfleteren³

2022

Flex. Print. Electron.

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“…Regarding the raw materials, PolyCarbonate (PC) is nowadays widely used in many industrial applications (automotive, construction, optical, etc). It is also the reference polymer material in IME [6,9,[13][14][15]. The reason is that PC is an amorphous polymer easy to thermoform with excellent mechanical and thermal properties.…”

Section: Introductionmentioning

confidence: 99%

In-Mold Electronics on Poly(Lactic Acid): towards a more sustainable mass production of plastronic devices

Goument

Gerges

Lombard

et al. 2023

Int J Adv Manuf Technol

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HAL is a multi-disciplinary open access archive for the deposit and dissemination of scientific research documents, whether they are published or not. The documents may come from teaching and research institutions in France or abroad, or from public or private research centers. L'archive ouverte pluridisciplinaire HAL, est destinée au dépôt et à la diffusion de documents scientifiques de niveau recherche, publiés ou non, émanant des établissements d'enseignement et de recherche français ou étrangers, des laboratoires publics ou privés.

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“…The assembly is exposed to high temperatures as well as pressures and shear stresses due to the molten viscous melt during overmolding. For that reason, TactoTek has postulated a certification process for cthe omponents and surface mounting adhesives used in their IMSE designs [ 3 , 4 , 5 ].…”

Section: Introductionmentioning

confidence: 99%

Process Optimization of Injection Overmolding Structural Electronics with Regard to Film Distortion

et al. 2022

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The integration of structural electronics in injection-molded parts is a challenging step. The films—comprising of laminated stacks with electronics—are exposed to shear stresses and elevated temperatures by the molten thermoplastic. Hence, molding settings have a significant impact on the successful, damage-free manufacturing of such parts. In this paper, test films with polycarbonate (PC) sheets as outer and two different thermoplastic polyurethanes (TPUs) as middle layers incorporating conductive tracks on a flexible printed circuit board (flexPCB) are manufactured and overmolded with PC. Parameter studies investigating the influence of the melt temperature, mold temperature, injection speed and used TPU layer were performed. The molded parts were inspected visually and compared with a numerical simulation using injection molding software. A shear distortion factor for the TPU layer was derived based on the simulations that linked the shear stresses with the injection time and the softening (melting) of the TPU. The distortion of the films was found to reduce with higher melt temperature, lower mold temperature and faster injection speed. Films using the TPU with the higher melting temperature yielded significantly better results. Moreover, distortion on the films reduced with the increasing distance to the gate and a larger cavity thickness was found to be beneficial. All those relations could be correlated with the shear distortion factor.

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Component Packages for IMSE™ (Injection Molded Structural Electronics)

Cited by 8 publications

References 0 publications

The integration of electronic circuits in plastics using injection technologies: a literature review

The integration of electronic circuits in plastics using injection technologies: a literature review

In-Mold Electronics on Poly(Lactic Acid): towards a more sustainable mass production of plastronic devices

Process Optimization of Injection Overmolding Structural Electronics with Regard to Film Distortion

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