2007 Proceedings 57th Electronic Components and Technology Conference 2007
DOI: 10.1109/ectc.2007.373965
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Comprehensive Assembly and Reliability Study of 0201's for High Reliability Applications for Utilizing both a Pb-Free and Sn/Pb Assembly Process

Abstract: A comprehensive study was undertaken to evaluate various board design parameters, assembly and reliability of 0201's as it relates to high reliability products. The design parameters considered included four pad designs, two trace width terminations, three orientations, three board thicknesses and four component to component spacing on a large PWB panel. The assembly parameter evaluation included, SnPb and Pb-free solder pastes for board assembly, which were built at four different board assembly locations. Th… Show more

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