2017 IEEE 35th VLSI Test Symposium (VTS) 2017
DOI: 10.1109/vts.2017.7928960
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Comprehensive investigation of gate oxide short in FinFETs

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Cited by 4 publications
(3 citation statements)
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“…SRAMs can be designed using FinFET devices, which are three-dimensional, multi-gate transistors [1]. During their manufacturing process, small particles and lithography inconsistencies can result in defects in their structure [19], e.g., partial opens, misplaced connections, and damaged fin structure [2][3][4]. These defects may impact a cell's ability to discharge its BLs during a read operation and hence impact the cell's BL swing, which is the voltage difference between a BL pair when the SA is enabled, i.e., BL swing = |BL−BL|.…”
Section: A Causes and Definitionmentioning
confidence: 99%
See 1 more Smart Citation
“…SRAMs can be designed using FinFET devices, which are three-dimensional, multi-gate transistors [1]. During their manufacturing process, small particles and lithography inconsistencies can result in defects in their structure [19], e.g., partial opens, misplaced connections, and damaged fin structure [2][3][4]. These defects may impact a cell's ability to discharge its BLs during a read operation and hence impact the cell's BL swing, which is the voltage difference between a BL pair when the SA is enabled, i.e., BL swing = |BL−BL|.…”
Section: A Causes and Definitionmentioning
confidence: 99%
“…The complex structure of FinFETs provides improved shortchannel behaviors while overcoming the planar CMOS technology's sub-threshold leakage [1]. Nevertheless, the process to manufacture such an intricate structure may also introduce defects in the transistor's features, such as opens in fins [2], pinholes in the oxide [3], and opens in the 3D gate [4]. These defects may affect FinFET SRAMs and cause Hardto-Detect faults [5] such as Random Read Faults (RRFs), i.e., a significantly reduced bit line swing [6].…”
Section: Introductionmentioning
confidence: 99%
“…During the manufacturing of FinFET devices, they can be affected by manufacturing defects such as opens in fins [1] and oxide pinholes [2]. In FinFET SRAMs, these defects cause Hard-to-Detect faults [3] such as Undefined State Faults (USFs), i.e., the cell's storing nodes are not in V DD or GND [4].…”
Section: Introductionmentioning
confidence: 99%