Comprehensive performance enhancement of conformal cooling process using thermal-load-based topology optimization

Wang, Min Liang; Zheng, Liang Jun; Bae, Sanghyuk; Kang, Hyun Wook

doi:10.1016/j.applthermaleng.2023.120332

Cited by 10 publications

(4 citation statements)

References 29 publications

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“…In particular, the influence of different heat flux distributions on the heat transfer efficiency of the TO design has been investigated. Wang et al [157] proposed a multiphysics TO for the conformal cooling channel design of the injection molding process. The overall cooling channel layout has been optimized based on the non-uniform thermal load distribution in the design domain, leading to both low-pressure drop and high heat transfer rate.…”

Section: Topology Optimization (To) Of Global Flow Configurationmentioning

confidence: 99%

Design and Optimization of Heat Sinks for the Liquid Cooling of Electronics with Multiple Heat Sources: A Literature Review

Li,

Roux,

Castelain

et al. 2023

Energies

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This paper presents a detailed literature review on the thermal management issue faced by electronic devices, particularly concerning uneven heating and overheating problems. Special focus is given to the design and structural optimization of heat sinks for efficient single-phase liquid cooling. Firstly, the paper highlights the common presence and detrimental consequences of electronics overheating resulting from multiple heat sources, supported by various illustrative examples. Subsequently, the emphasis is placed on single-phase liquid cooling as one of the effective thermal management technologies for power electronics, as well as on the enhancement of heat transfer in micro/mini channel heat sinks. Various studies on the design and structural optimization of heat sinks are then analyzed and categorized into five main areas: (1) optimization of channel cross-section shape, (2) optimization of channel flow passage, (3) flow distribution optimization for parallel straight channel heat sinks, (4) optimization of pin-fin shape and arrangement, and (5) topology optimization of global flow configuration. After presenting a broad and complete overview of the state of the art, the paper concludes with a critical analysis of the methods and results from the literature and highlights the research perspectives and challenges in the field. It is shown that the issue of uneven and overheating caused by multiple heat sources, which is commonly observed in modern electronics, has received less attention in the literature compared to uniform or single-peak heating. While several design and structural optimization techniques have been implemented to enhance the cooling performance of heat sinks, topology optimization has experienced significant advancements in recent years and appears to be the most promising technology due to its highest degree of freedom to treat the uneven heating problem. This paper can serve as an essential reference contributing to the development of liquid-cooling heat sinks for efficient thermal management of electronics.

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Section: Topology Optimization (To) Of Global Flow Configurationmentioning

confidence: 99%

Design and Optimization of Heat Sinks for the Liquid Cooling of Electronics with Multiple Heat Sources: A Literature Review

Li,

Roux,

Castelain

et al. 2023

Energies

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“…However, the methodology does not exempt itself from relying on an initial proposal provided by the designer, and utilizes a simplified cycle-averaged approach, which may overlook temperature fluctuations ranging from 14% to 40% or more, depending on the distance between the CCs and the cavity surface [20]. A recent study conducted by Wang et al [25] introduced a comprehensive TO approach for the IM process. In their approach, the incompressible Navier-Stokes and energy conservation equations were addressed in a steady state using a pseudo-density method.…”

Section: Introductionmentioning

confidence: 99%

A numerical framework for three-dimensional optimization of cooling channels in thermoplastic printed molds

Storti,

Sobotka

2024

Applied Thermal Engineering

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“…This production process is distinguished by its rigorous specifications, demanding resistant and long-lasting tooling to guarantee the production of high-quality parts in an optimal time. The geometric complexity of plastic parts manufactured using injection molding, with free shapes, clips, bosses and stiffeners, implies challenges in demolding, requiring sophisticated mechanical systems composed of multiple pieces of various materials that must function in a synchronized manner [3]. Furthermore, given the high pressure during the process, molds usually divide the cavity into interchangeable parts to avoid deformations in small part details due to bending stresses that would require changing the entire cavity [4].…”

Section: Introductionmentioning

confidence: 99%

Enhancing Complex Injection Mold Design Validation Using Multicombined RV Environments

Mercado-Colmenero,

Garcia-Molina,

Gutierrez-Jiménez

et al. 2024

Applied Sciences

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The intricate design of real complex injection molds poses significant challenges. Mold design validation often falls to operators with tool-handling experience but limited CAD proficiency. Unlike other industries, the scale and costs of injection mold fabrication hinder prototyping before production. Virtual reality (VR) has emerged as a revolutionary solution offering a safe, immersive, and realistic experience and accessible using QR codes. This paper presents a new multimodal virtual environment tailored to validate mold design complexities. Integrating knowledge-enriched visual tools like interactive 3D models and dynamic visualizations enables users to explore complex mold designs. Statistical analyses, including the Wilcoxon test, unveil significant differences in interference detection, internal topology tracking, and validation of assembly and disassembly accessibility for both small and large mold components when comparing validation conducted through traditional means using solely CAD systems versus the utilization of multidimensional validation methods. Efficiency gains in using VR devices for mold design validation in a hybrid environment in the analysis of relative frequencies. The present study surpasses the state of the art illustrating how VR technology can substantially reduce manufacturing errors in injection molding processes, thereby offering important advantages for manufacturers emerging as an essential tool for this impact industry in the next years.

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Comprehensive performance enhancement of conformal cooling process using thermal-load-based topology optimization

Cited by 10 publications

References 29 publications

Design and Optimization of Heat Sinks for the Liquid Cooling of Electronics with Multiple Heat Sources: A Literature Review

Design and Optimization of Heat Sinks for the Liquid Cooling of Electronics with Multiple Heat Sources: A Literature Review

A numerical framework for three-dimensional optimization of cooling channels in thermoplastic printed molds

Enhancing Complex Injection Mold Design Validation Using Multicombined RV Environments

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